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1. WO1996006457 - SEMICONDUCTOR DEVICE WITH AT LEAST ONE SEMICONDUCTOR COMPONENT

Publication Number WO/1996/006457
Publication Date 29.02.1996
International Application No. PCT/DE1995/001100
International Filing Date 21.08.1995
Chapter 2 Demand Filed 21.03.1996
IPC
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 23/367 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
CPC
H01L 23/3135
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3107the device being completely enclosed
3135Double encapsulation or coating and encapsulation
H01L 23/3675
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
3675characterised by the shape of the housing
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/13091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
10Details of semiconductor or other solid state devices to be connected
11Device type
13Discrete devices, e.g. 3 terminal devices
1304Transistor
1306Field-effect transistor [FET]
13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
H01L 2924/19041
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
1901Structure
1904Component type
19041being a capacitor
Applicants
  • DYLEC LTD. [GB/GB]; La Plaiderie Saint Peter Port Guernsey, GB (AllExceptUS)
  • BAUER, Heinz [DE/DE]; DE (UsOnly)
Inventors
  • BAUER, Heinz; DE
Agents
  • FRHR. V. SCHORLEMER, R.; Karthäuser Strasse 5A D-34117 Kassel, DE
Priority Data
G 94 13 550.9 U23.08.1994DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) HALBLEITERANORDNUNG MIT WENIGSTENS EINEM HALBLEITERBAUELEMENT
(EN) SEMICONDUCTOR DEVICE WITH AT LEAST ONE SEMICONDUCTOR COMPONENT
(FR) DISPOSITIF A SEMI-CONDUCTEUR COMPRENANT AU MOINS UN COMPOSANT A SEMI-CONDUCTEUR
Abstract
(DE)
Die Erfindung betrifft eine Halbleiteranordnung mit wenigstens einem diskreten oder als integrierte Schaltung ausgebildeten Halbleiterbauelement (1), das zumindest teilweise mit einer der Wärmeableitung dienenden Vergußmasse (6) versehen ist, die eine hohe Wärmeleitfähigkeit und Durchschlagsfestigkeit besitzt.
(EN)
The invention concerns a semiconductor device with at least one semiconductor component (1) which is designed either as a discrete component or as an integrated circuit, the semiconductor component being at least partly covered with a sealing compound which serves a heat-dissipation function and has a high thermal conductivity and high dielectric strength.
(FR)
L'invention concerne un dispositif à semi-conducteur comprenant au moins un composant à semi-conducteur (1) se présentant sous forme de circuit à composants discrets ou de circuit intégré, muni au moins en partie d'une matière de scellement (69) servant à dissiper la chaleur et présentant une forte conductibilité thermique et une grande rigidité diélectrique.
Also published as
Latest bibliographic data on file with the International Bureau