Processing

Please wait...

Settings

Settings

1. WO1996005970 - A PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURE THEREOF

Publication Number WO/1996/005970
Publication Date 29.02.1996
International Application No. PCT/US1994/009721
International Filing Date 25.08.1994
Chapter 2 Demand Filed 11.03.1996
IPC
H05K 3/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/42 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes
CPC
H05K 2201/0344
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0335Layered conductors or foils
0344Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
H05K 3/108
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
108by semi-additive methods; masks therefor
H05K 3/426
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
425characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
426initial plating of through-holes in substrates without metal
Applicants
  • PARLEX CORPORATION [US/US]; 145 Milk Street Methuen, MA 01844, US
Inventors
  • MC KENNEY, Darryl, J.; US
  • CYR, Robert, D.; US
Agents
  • TURANO, Thomas, A. ; Weingarten, Schurgin, Gagnebin & Hayes Ten Post Office Square Boston, MA 02109, US
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) A PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURE THEREOF
(FR) PLAQUETTE A CIRCUIT IMPRIME ET FABRICATION DE LADITE PLAQUETTE
Abstract
(EN)
A method of depositing a conductive material (20) on a surface of a printed circuit board (10) includes the steps of chemically treating at least a portion of a surface of the printed circuit board, disposing a resist layer (16) over the chemically treated surface (12), depositing a conductive layer (20) in the areas which are not covered by the resist (16), stripping the resist from the surface of the printed circuit board (10), and cleaning exposed chemically treated surfaces of the printed circuit board (10) to remove contaminants from the surface of the printed circuit board (10) which were introduced in the chemically treating step.
(FR)
Procédé de dépôt d'un matériau conducteur (20) sur une surface d'une plaquette (10) à circuit imprimé, qui consiste à soumettre à un traitement chimique au moins une partie d'une surface de la plaquette à circuit imprimé, à déposer une couche de résist (16) sur la surface (12) soumise au traitement chimique, à déposer une couche conductrice (20) dans les zones qui ne sont pas couvertes par le résist (16), à éliminer le résist de la surface de la plaquette (10) de circuit imprimé, et à nettoyer les surfaces exposées soumises au traitement chimique de la plaquette (10) pour éliminer de la surface de la plaquette (10) les contaminants introduits lors de l'étape de traitement chimique.
Latest bibliographic data on file with the International Bureau