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1. WO1996005714 - METHOD AND APPARATUS FOR SOLDERING INSPECTION OF CIRCUIT BOARD

Publication Number WO/1996/005714
Publication Date 22.02.1996
International Application No. PCT/JP1995/001569
International Filing Date 08.08.1995
Chapter 2 Demand Filed 06.03.1996
IPC
B23K 31/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
31Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/-B23K28/193
12relating to investigating the properties, e.g. the weldability, of materials
G01N 23/04 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
23Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/-G01N17/178
02by transmitting the radiation through the material
04and forming images of the material
G01R 31/304 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
302Contactless testing
304of printed or hybrid circuits
H05K 13/08 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
CPC
B23K 2101/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
40Semiconductor devices
B23K 2101/42
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
42Printed circuits
B23K 31/12
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
31Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
12relating to investigating the properties, e.g. the weldability, of materials
G01N 23/044
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
23Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00G01N17/00, G01N21/00 or G01N22/00
02by transmitting the radiation through the material
04and forming images of the material
044using laminography or tomosynthesis
G01R 31/304
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
302Contactless testing
304of printed or hybrid circuits
H05K 13/0465
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
046Surface mounting
0465by soldering
Applicants
  • KABUSHIKI KAISHA KOBE SEIKO SHO [JP/JP]; 3-18, Wakinohamacho 1-chome Chuo-ku Kobe-shi Hyogo 651, JP (AllExceptUS)
  • KOIKE, Shiro [JP/JP]; JP (UsOnly)
  • MORITA, Yasuo [JP/JP]; JP (UsOnly)
  • KAKEBAYASHI, Yasunori [JP/JP]; JP (UsOnly)
  • YOSHIDA, Eiji [JP/JP]; JP (UsOnly)
  • NISHIJIMA, Taro [JP/JP]; JP (UsOnly)
  • MORI, Yoshikazu [JP/JP]; JP (UsOnly)
Inventors
  • KOIKE, Shiro; JP
  • MORITA, Yasuo; JP
  • KAKEBAYASHI, Yasunori; JP
  • YOSHIDA, Eiji; JP
  • NISHIJIMA, Taro; JP
  • MORI, Yoshikazu; JP
Agents
  • KAJI, Yoshiyuki; Recruit Shin Osaka Building 14-22, Nishinakajima 5-chome Yodogawa-ku Osaka-shi Okasa 532, JP
Priority Data
6/18600208.08.1994JP
6/18707509.08.1994JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD AND APPARATUS FOR SOLDERING INSPECTION OF CIRCUIT BOARD
(FR) PROCEDE ET DISPOSITIF DE VERIFICATION DES SOUDURES D'UNE PLAQUETTE DE CIRCUIT IMPRIME
Abstract
(EN)
A soldering inspection method and an apparatus therefor capable of improving soldering inspection accuracy by obtaining a higher precision X-ray transmission image corresponding well to the actual shape of a circuit board. The soldering inspection method comprises a step (23) of obtaining a one-face transmission image by irradiating X-rays to a circuit board having components mounted on only one side, steps (22, 27) of executing soldering inspection by using the one-side transmission image, a step (17) of obtaining a transmission image of a two-sided board by directing X-rays to the substrate having components mounted on both sides, steps (15, 18) of executing response correction so as to make response characteristics substantially constant within a predetermined spatial frequency range on the basis of the response characteristics to the spatial frequency of the imaging system and the image processing system in a transmission image read step of the one-side transmission image and the two-side transmission image, a step (20) of obtaining a transmission image of only the other side by subtracting the one-side transmission image subjected to response correction from the transmission image of the two-sided board subjected to response correction, and a step (21) of executing soldering inspection of the other side by using the transmission image of the other side. The present invention provides an apparatus for practicing this method.
(FR)
Procédé et dispositif permettant d'améliorer la finesse de vérification de soudures au moyen d'une transmission d'image par rayons X extrêmement précise correspondant bien à la forme réelle d'une plaquette de circuit imprimé. Ce procédé consiste, dans une première étape (23), à obtenir une image présentant une seule face par radiographie d'une plaquette, dont les composants ne sont montés que sur un côté; dans des étapes (22, 27), à effectuer une vérification des soudures au moyen de l'image précédente à une face; dans une étape (17), à obtenir une image d'une plaquette à deux côtés par orientation des rayons X vers le substrat, dont les composants sont montés sur les deux côtés; dans des étapes (15, 18), à exécuter une correction de réaction, afin de rendre les caractéristiques de réaction sensiblement constantes à l'intérieur d'une plage prédéterminée de fréquences spatiales, sur la base des caractéristiques de réaction à la fréquence spatiale du système d'imagerie et du système de traitement d'image dans une étape de lecture de l'image à une face et de l'image à deux faces; dans une étape (20), à obtenir une image de l'autre côté uniquement par soustraction de l'image à une face soumise à la correction de réaction de l'image de la plaquette à deux côtés soumise à la correction de réaction; et dans une étape (21), à exécuter une vérification des soudures de l'autre côté au moyen de l'image de l'autre côté. L'invention concerne également un dispositif de mise en application de ce procédé.
Also published as
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