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1. WO1996005617 - IMPROVED WAFER AND METHOD OF MAKING SAME

Publication Number WO/1996/005617
Publication Date 22.02.1996
International Application No. PCT/US1995/007521
International Filing Date 12.06.1995
Chapter 2 Demand Filed 12.03.1996
IPC
G01H 11/06 2006.01
GPHYSICS
01MEASURING; TESTING
HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
11Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
06by electric means
H01L 27/20 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
20including piezo-electric components; including electrostrictive components; including magnetostrictive components
CPC
G01H 11/06
GPHYSICS
01MEASURING; TESTING
HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
11Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties ; , e.g. capacitance or reluctance
06by electric means
H01L 27/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
20including piezo-electric components; including electrostrictive components; including magnetostrictive components
Y10S 148/028
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
148Metal treatment
028Dicing
Y10S 438/928
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
438Semiconductor device manufacturing: process
928Front and rear surface processing
Applicants
  • THE CHARLES STARK DRAPER LABORATORY, INC. [US/US]; 555 Technology Square Cambridge, MA 02139, US
Inventors
  • BERNSTEIN, Jonathan, J.; US
Agents
  • IANDIORIO, Joseph, S. ; Iandiorio & Teska 260 Bear Hill Road Waltham, MA 02154, US
Priority Data
08/289,68812.08.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) IMPROVED WAFER AND METHOD OF MAKING SAME
(FR) TRANCHE AMELIOREE ET SON PROCEDE DE FABRICATION
Abstract
(EN)
A wafer and a method of making a wafer containing a plurality of severable transducer chips includes a wafer; a plurality of transducer chips formed on the wafer; and a grid of longitudinal and latitudinal grooves in the wafer for separating the chips from each other and enabling them to be easily, individually severed from the wafer, as well as a transducer chip and a method of making it, having integrally raised contacts adapted for a flip chip or beam lead interconnection, with a transducer formed on the chip; and a plurality of raised contacts integrally formed with the chip and electrically interconnected with the transducer.
(FR)
L'invention se rapporte à une tranche et à son procédé de fabrication, cette tranche comprenant une pluralité de puces de transducteur séparables, ces dernières étant formées sur la tranche, et une grille de rainures longitudinales et latitudinales formées dans la tranche en vue de séparer les puces les unes des autres et leur permettre de se séparer facilement, individuellement de la tranche. L'invention se rapporte également à une puce de transducteur et à son procédé de fabrication, cette puce comportant des contact surélevés intégraux conçus pour une puce à protubérances ou une interconnexion à pattes, un transducteur étant formé sur la puce; et une pluralité de contacts surélevés faisant partie intégrante de la puce et interconnectés électriquement au transducteur.
Also published as
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