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1. WO1996005615 - PLASTIC SUBSTRATE FOR ELECTRONIC CIRCUITS WITH BONDABLE CONTACT PINS

Publication Number WO/1996/005615
Publication Date 22.02.1996
International Application No. PCT/EP1995/003121
International Filing Date 05.08.1995
Chapter 2 Demand Filed 18.01.1996
IPC
H01L 23/055 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape
053the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
055the leads having a passage through the base
H01L 23/495 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
495Lead-frames
CPC
H01L 23/055
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
053the container being a hollow construction and having an insulating ; or insulated; base as a mounting for the semiconductor body
055the leads having a passage through the base
H01L 23/49551
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49541Geometry of the lead-frame
49548Cross section geometry
49551characterised by bent parts
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • DODUCO GMBH + CO. [DE]/[DE] (AllExceptUS)
  • SCHULZE, Gunter [DE]/[DE] (UsOnly)
  • GEBHARD, Reiner [DE]/[DE] (UsOnly)
Inventors
  • SCHULZE, Gunter
  • GEBHARD, Reiner
Agents
  • TWELMEIER, Ulrich
Priority Data
P 44 28 319.910.08.1994DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) TRÄGER AUS EINEM KUNSTSTOFF FÜR EINE ELEKTRONISCHE SCHALTUNG MIT BONDBAREN KONTAKTSTIFTEN
(EN) PLASTIC SUBSTRATE FOR ELECTRONIC CIRCUITS WITH BONDABLE CONTACT PINS
(FR) SUPPORT EN MATIERE PLASTIQUE POUR CIRCUITS ELECTRONIQUES A BROCHES DE CONTACT PERMETTANT DE REALISER DES LIAISONS
Abstract
(DE)
Träger (1) aus einem Kunststoff für eine elektronische Schaltung, mit Kontaktstiften (5), welche den Träger (1) durchsetzen und auf einer ersten Seite (24) des Trägers (1) einen bondbaren Abschnitt (8) haben, welcher zum Anschließen der Schaltung mittels Drähten dient, die durch Bonden mit den Kontaktstiften (5) zu verbinden sind, wohingegen die Kontaktstifte (5) von einer der ersten Seite (24) des Trägers (1) abgewandten zweiten Seite hervorstehen. Die Kontaktstifte (5) sind an ihrem einen Ende unter Bildung von zwei ungleich langen Schenkeln (6, 7) U-förmig derart abgewinkelt, daß der bondbare Abschnitt (8) die beiden Schenkel (6, 7) verbindet, der längere Schenkel (6) den Träger (1) durchsetzt und der kürzere Schenkel (7) in den Träger (1) eindringt.
(EN)
A plastic substrate (1) for electronic circuits has contact pins (5) which extend through the substrate (1) and have a bondable section (8) at the first side (24) of the substrate (1). The bondable section (8) serves to connect the circuit by means of wires that are connected by bonding to the contact pins (5) which project from a second side of the substrate (1) opposite to the first side (24). The contact pins (5) are U-shaped at one end, forming two legs (6, 7) of different lengths interconnected by the bondable section (8). The longer leg (6) extends through the substrate (1) and the shorter leg (7) only penetrates into the substrate (1).
(FR)
Un support (1) en matière plastique pour circuits électroniques comprend des broches de contact (5) qui traversent le support (1) et qui ont d'un côté (24) du support (1) une section (8) qui permet de réaliser une liaison. La section (8) sert à connecter le circuit au moyen de fils métalliques à relier aux broches de contact (5), alors que les broches de contact (5) font saillie sur un deuxième côté du support (1) opposé au premier côté (24) du support. Les broches de contact (5) sont coudées en U à une extrémité de manière à former deux branches (6, 7) de différentes longueurs interconnectées par la section (8) qui permet de réaliser une liaison. La branche plus longue (6) traverse le support (1) et la branche plus courte (7) ne fait que pénétrer dans le support (1) sans le traverser.
Also published as
Latest bibliographic data on file with the International Bureau