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1. WO1996005477 - HIGH PRECISION SEMICONDUCTOR COMPONENT ALIGNMENT SYSTEMS

Publication Number WO/1996/005477
Publication Date 22.02.1996
International Application No. PCT/US1995/010287
International Filing Date 11.08.1995
Chapter 2 Demand Filed 08.03.1996
IPC
G01B 11/00 2006.01
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
G01B 11/27 2006.01
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
26for measuring angles or tapers; for testing the alignment of axes
27for testing the alignment of axes
CPC
G01B 11/00
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
G01B 11/272
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
26for measuring angles or tapers; for testing the alignment of axes
27for testing the alignment of axes
272using photoelectric detection means
Applicants
  • CYBEROPTICS CORPORATION [US/US]; 2505 Kennedy Street Minneapolis, MN 55413, US
Inventors
  • CASE, Steven, K.; US
  • JALKIO, Jeffrey, A.; US
  • HAUGAN, Carl, E.; US
  • RUDD, Eric; US
  • PETERSON, Bruce; US
Agents
  • PATTERSON, James, H.; Patterson & Keough, P.A. 1200 Rand Tower 527 Marquette Avenue South Minneapolis, MN 55402 , US
Priority Data
08/289,27911.08.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) HIGH PRECISION SEMICONDUCTOR COMPONENT ALIGNMENT SYSTEMS
(FR) SYSTEMES D'ALIGNEMENT DE HAUTE PRECISION DE COMPOSANTS SEMICONDUCTEURS
Abstract
(EN)
The sensor system (45) consists of a light source (60) and an optical lens system (61, 71, 78) which causes more light to pass a component (30) to obtain a sharper component image on a sensor array (65). Due to the optical lens systems disclosed, either laser diodes (62), LED's (66), or other suitable light sources can be used since optical efficiency is substantially increased. The sensor system (45) is mounted directly on the carrying mechanism (43) for the surface mount component placement machine. During transit of the component (30) between the bin of components (32) and the circuit board (34) upon which the component (30) is to be placed, the component (30) is rotated and the sharp shadow which falls on the detector array (65) is monitored. Several processing algorithms are disclosed for determining correct component angular orientation and coordinate (X, Y) location of the component (30) on the vacuum quill (24). Thereafter, the sensor (65) sends correcting signals to the component placement machine.
(FR)
Ce système de capteur (45) consiste en une source lumineuse (60) et en un système de lentilles optiques (61, 71, 78) qui permet à une plus grande partie de la lumière de traverser un composant (30), donnant ainsi une image plus nette de ce composant sur un ensemble de capteurs (65). Avec ces systèmes de lentilles optiques, des diodes lasers (62), des diodes électroluminescentes (66) ou toutes autres sources de lumière appropriées peuvent être utilisées du fait que le rendement optique se trouve considérablement accru. Le système de capteur (45) est monté directement sur le mécanisme de support (43) de la machine de positionnement des composants sur une surface. Au cours du transfert du composant (30) entre le bac à composants (32) et la plaquette de circuits imprimés (34) sur laquelle chaque composant (30) doit être placé, ce composant (30) est mis en rotation, et l'ombre prononcée qui se projette sur l'ensemble de capteurs (65) est observée. L'invention porte sur plusieurs algorithmes de traitement qui permettent de déterminer l'orientation angulaire correcte du composant ainsi que les coordonnées (X, Y) de positionnement du composant (30) sur les douilles à vide (24). Le capteur (65) communique ensuite des signaux de correction à la machine de positionnement des composants.
Also published as
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