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1. WO1996005330 - SILVER PALLADIUM ALLOY

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[ EN ]

CLAIMS
Having thus described the invention, what is claimed is:
1. A silver/palladium alloy for electronic
applications consisting essentially of:
(a) 35-60 percent by weight silver;
(b) 20-44 percent by weight palladium;
(c) 5-20 percent by weight copper;
(d) 1-7 percent by weight nickel;
(e) 0.1-5 percent by weight zinc;
(f) 0.06-0.18 percent by weight boron;
(g) up to 0.05 percent by weight rhenium; and
(h) up to 1 percent by weight of modifying
elements selected from the group consisting of
ruthenium, zirconium and platinum, said alloy
exhibiting high oxidation and tarnish resistance.
2. The silver/palladium alloy in accordance with Claim 1 wherein silver comprises 45-50 percent by weight and palladium comprises 30-35 percent by weight.
3. The silver/palladium alloy in accordance with Claim 2 wherein copper comprises 12-16 percent by weight and nickel comprises 4-6 percent by weight.
4. The silver/palladium alloy in accordance with Claim 1 wherein said alloy contains 0.06-0.12 percent by weight boron.
5. The silver/palladium alloy in accordance with Claim 1 wherein said alloy contains 0.02-0.1 percent by weight rhenium.

6. A silver/palladium alloy for electronic
applications consisting essentially of:
(a) 35-60 percent by weight silver;
(b) 20-44 percent by weight palladium;
(c) 5-20 percent by weight copper;
(d) 1-7 percent by weight nickel;
(e) 0.1-5 percent by weight zinc;
(f) 0.06-0.12 percent by weight boron;
(g) up to 0.02-0.1 percent by weight rhenium; and (h) up to 1 percent by weight of modifying
elements selected from the group consisting of
ruthenium, zirconium and platinum, said alloy
exhibiting high oxidation and tarnish resistance.
7. The silver/palladium alloy in accordance with Claim 6 wherein silver comprises 45-50 percent by weight and palladium comprises 30-35 percent by weight.
8. The silver/palladium alloy in accordance with Claim 6 wherein copper comprises 12-16 percent by weight and nickel comprises 4-6 percent by weight.
9. A wrought metal electronic component formed from a silver/palladium alloy consisting essentially of:
(a) 35-60 percent by weight silver;
(b) 20-44 percent by weight palladium;
(c) 5-20 percent by weight copper;
(d) 1-7 percent by weight nickel;
(e) 0.1-5 percent by weight zinc;
(f) 0.06-0.18 percent by weight boron;
(g) up to 0.05 percent by weight rhenium; and (h) up to 1 percent by weight of modifying
elements selected from the group consisting of
ruthenium, zirconium and platinum.
10. The wrought metal electronic component is
accordance with Claim 9 wherein said component exhibits high oxidation and tarnish resistance.
11. The wrought metal electronic component in
accordance with Claim 10 wherein said contact resistance is less than 50 milliohms after 1000 hours exposure to air at 150°C.
12. The wrought metal electronic component in
accordance with Claim 10 wherein said contact resistance is less than 250 milliohms after 30 days exposure to a humid sulfurous atmosphere at 50°C.
13. The wrought metal electronic component in
accordance with Claim 9 wherein said component exhibits a modulus of at least 15 x 106 p.s.i..