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1. WO1996004772 - INTERNALLY DAMPED CIRCUIT ARTICLES

Publication Number WO/1996/004772
Publication Date 15.02.1996
International Application No. PCT/US1995/009486
International Filing Date 27.07.1995
Chapter 2 Demand Filed 19.02.1996
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
H05K 1/0271
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
H05K 1/036
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
0353consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
036Multilayers with layers of different types
H05K 2201/0133
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0104Properties and characteristics in general
0133Elastomeric or compliant polymer
H05K 2201/0209
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0209Inorganic, non-metallic particles
H05K 2201/2045
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
2045Protection against vibrations
Y10T 428/24917
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
24Structurally defined web or sheet [e.g., overall dimension, etc.]
24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
24917including metal layer
Applicants
  • MINNESOTA MINING AND MANUFACTURING COMPANY [US/US]; 3M Center P.O. Box 33427 Saint Paul, MN 55133-3427, US
Inventors
  • MCCUTCHEON, Jeffrey, W.; US
Agents
  • DOWDALL, Janice, L. ; Minnesota Mining and Manufacturing Company Office of Intellectual Property Counsel P.O. Box 33427 Saint Paul, MN 55133-3427, US
  • CABINET REGIMBEAU; Martin, Schrimpf, Warcoin, Ahner, Texier, Le Forestier 26, avenue Kléber F-75116 Paris, FR
Priority Data
08/283,09629.07.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) INTERNALLY DAMPED CIRCUIT ARTICLES
(FR) ARTICLES A CIRCUITS IMPRIMES A AMORTISSEMENT INTERNE
Abstract
(EN)
The present invention provides a method of improving the vibrational damping characteristics of a circuit article (1). The method involves adding damping layer(s) (2) to the laminate material that is processed into a circuit article (1). The damping material effectively increases the damping of the circuit article and reduces the amplitude of resonant frequencies of the circuit article excited by environmental vibrations or shocks that the circuit board may encounter in use and thereby potentially improving the performance of the circuit article for vibration and schock related performance issues without the addition of add-on dampers to the circuit articles surface or by isolating the circuit board by means of vibration and shock isolators.
(FR)
La présente invention concerne un procédé d'amélioration des caractéristiques d'amortissement des vibrations d'un article à circuits imprimés (1). Le procédé consiste à ajouter au moins une couche d'amortissement (2) à la matière stratifiée utilisée pour réaliser l'article (1). Le matériau d'amortissement accroît effectivement l'effet d'amortissement de l'article et réduit l'amplitude des fréquences de résonance de l'article lorsqu'il est excité par les vibrations ou les chocs mécaniques imputables à l'environnement que la carte à circuits imprimés peut subir pendant l'utilisation. Ce procédé améliore donc les performances de l'article en ce qui concerne les aspects de qualité de fonctionnement se rapportant aux vibrations et aux chocs mécaniques, et ce, sans ajouter d'éléments amortissement rapportés sur la surface de l'article, ni en isolant la carte à circuits imprimés au moyen d'éléments d'isolation contre les vibrations et les chocs.
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