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1. WO1996004683 - METHOD OF MANUFACTURING A THREE-DIMENSIONAL CIRCUIT

Publication Number WO/1996/004683
Publication Date 15.02.1996
International Application No. PCT/DE1995/000998
International Filing Date 01.08.1995
Chapter 2 Demand Filed 10.10.1995
IPC
H01L 21/98 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
98Assembly of devices consisting of solid state components formed in or on a common substrate; Assembly of integrated circuit devices
H01L 25/065 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/78
CPC
H01L 2225/06513
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06513Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
H01L 2225/06555
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06555Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
H01L 25/0657
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
0657Stacked arrangements of devices
H01L 25/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
50Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • SIEMENS AKTIENGESELLSCHAFT [DE/DE]; Wittelsbacherplatz 2 D-80333 München, DE (AllExceptUS)
  • HÜBNER, Holger [DE/DE]; DE (UsOnly)
Inventors
  • HÜBNER, Holger; DE
Priority Data
P 44 27 515.303.08.1994DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUR HERSTELLUNG EINER DREIDIMENSIONALEN SCHALTUNGSANORDNUNG
(EN) METHOD OF MANUFACTURING A THREE-DIMENSIONAL CIRCUIT
(FR) PROCEDE DE FABRICATION D'UN CIRCUIT TRIDIMENSIONNEL
Abstract
(DE)
Eine Bauelemente (13) umfassende Substratscheibe wird auf eine Trägerplatte (3) aufgeklebt und von der Rückseite her gedünnt. Nach Erzeugung einer Photolackmaske auf der Rückseite der Substratscheibe wird diese in einem Ätzprozeß in einzelne Bauelemente (13) vereinzelt. Nach Entfernen der Photolackmaske wird auf mindestens eines der einzelnen Bauelemente (13) ein weiteres Bauelement (6), insbesondere ein Bauelementstapel, aufgebracht und fest mit dem einzelnen Bauelement (13a) verbunden.
(EN)
A substrate wafer comprising components (13) is bonded to a support plate (3) and reduced in thickness from the rear side. A photoresist mask is created on the rear face of the substrate plate which is then separated into individual components (13) by an etching process. The photoresist mask is removed and a further component (6), in particular a component stack, is applied to at least one of the individual components (13) and securely attached to the individual component in question (13a).
(FR)
L'invention concerne un procédé consistant à coller, sur une plaquette de support (3), un substrat comportant des composants (13) puis à diminuer l'épaisseur de ce substrat, en partant de sa face inférieure. Après production d'un masque de photorésist sur la face inférieure du substrat, on procède à une attaque chimique du substrat afin d'obtenir des composants individuels (13). Après retrait du masque de photorésist, on dépose, sur au moins l'un des composants individuels (13), un autre composant (6), en particulier une pile de composants, que l'on raccorde ensuite de façon solide au composant individuel (13a).
Also published as
EP1995926834
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