Processing

Please wait...

Settings

Settings

1. WO1996004682 - ELECTRONIC CIRCUIT PACKAGE

Publication Number WO/1996/004682
Publication Date 15.02.1996
International Application No. PCT/GB1995/001785
International Filing Date 27.07.1995
IPC
H01L 23/498 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
CPC
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 23/49833
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49833the chip support structure consisting of a plurality of insulating substrates
H01L 23/4985
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
4985Flexible insulating substrates
H01L 2924/15173
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
151Die mounting substrate
1517Multilayer substrate
15172Fan-out arrangement of the internal vias
15173in a single layer of the multilayer substrate
H01L 2924/3025
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
30Technical effects
301Electrical effects
3025Electromagnetic shielding
Applicants
  • HAVANT INTERNATIONAL LIMITED [GB/GB]; P.O. Box 6 Langstone Road Havant Hampshire PO9 1SA, GB (AllExceptUS)
  • MEDLOCK, Katherine, Margaret [GB/GB]; GB (UsOnly)
  • COWBURN, Anthony, Richard [GB/GB]; GB (UsOnly)
  • SAVAGE, Clive, Peter [GB/GB]; GB (UsOnly)
  • MORGAN, William, Morris [GB/GB]; GB (UsOnly)
Inventors
  • MEDLOCK, Katherine, Margaret; GB
  • COWBURN, Anthony, Richard; GB
  • SAVAGE, Clive, Peter; GB
  • MORGAN, William, Morris; GB
Agents
  • LAIGHT, Martin, H.; W.H. Beck, Greener & Co. 7 Stone Buildings Lincoln's Inn London WC2A 3SZ, GB
Priority Data
9415297.229.07.1994GB
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTRONIC CIRCUIT PACKAGE
(FR) BOITIER DE CIRCUITS ELECTRONIQUES
Abstract
(EN)
An electronic circuit package comprises a carrier substrate (20), e.g. in the form of a flexible circuit, having a plurality of electrical contacts (80) defined thereon, an integrated circuit device (10) mounted on the substrate including a plurality of terminals (30) located towards the periphery of the device, the plurality of terminals being individually connected by means of conductive wires (31) to a corresponding electrical contact (80, 82) on the substrate. The package further comprises a conductive path means acting as a conductive bridge between a selected device terminal (50) and an associated electrical contact (108) on the substrate, the conductive path means comprising a conductive region (172) defined in or on an outward facing surface of the device, the selected terminal connected by a first conductive wire (180) to the conductive region which is in turn connected by a second conductive wire (182) to the associated electrical contact.
(FR)
Un boîtier de circuits électroniques comprend un substrat-support (20), se présentant, p. ex., sous la forme d'un circuit flexible, comportant une pluralité de contacts électriques (80), un dispositif à circuits intégrés (10) monté sur le substrat et comportant une pluralité de bornes (30) placées vers la périphérie du dispositif, ces bornes étant individuellement raccordées au moyen de fils conducteurs (31) à un contact électrique correspondant (80, 82) du substrat. Le boîtier comprend également une voie conductrice servant de pont conducteur entre une borne sélectionnée (50) du dispositif et un contact électrique associé (108) du substrat, la voie conductrice comportant une région conductrice (172) formée dans ou sur une surface extérieure opposée du dispositif, la borne sélectionnée étant raccordée par un premier fil conducteur (180) à la région conductrice qui est à son tour raccordée par un second fil conducteur (182) au contact électrique associé.
Also published as
Latest bibliographic data on file with the International Bureau