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1. WO1996004680 - METHOD OF REMOVING SHARP EDGES OF DIELECTRIC COATINGS ON SEMICONDUCTOR SUBSTRATES AND DEVICE PRODUCED

Publication Number WO/1996/004680
Publication Date 15.02.1996
International Application No. PCT/US1995/009968
International Filing Date 21.07.1995
IPC
H01L 21/768 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71Manufacture of specific parts of devices defined in group H01L21/7086
768Applying interconnections to be used for carrying current between separate components within a device
CPC
H01L 21/76819
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
71Manufacture of specific parts of devices defined in group H01L21/70
768Applying interconnections to be used for carrying current between separate components within a device ; comprising conductors and dielectrics
76801characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
76819Smoothing of the dielectric
Y10S 438/978
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
438Semiconductor device manufacturing: process
978forming tapered edges on substrate or adjacent layers
Applicants
  • MICROCHIP TECHNOLOGY, INC. [US/US]; 2355 W. Chandler Boulevard Chandler, AZ 85224, US
Inventors
  • JACKSON, Daniel, J.; US
Agents
  • WEISS, Harry, M.; Harry M. Weiss & Associates, P.C. 4204 N. Brown Avenue Scottsdale, AZ 85251, US
Priority Data
08/283,60301.08.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF REMOVING SHARP EDGES OF DIELECTRIC COATINGS ON SEMICONDUCTOR SUBSTRATES AND DEVICE PRODUCED
(FR) PROCEDE D'ELIMINATION DES ANGLES VIFS DE REVETEMENTS DIELECTRIQUES SUR DES SUBSTRATS DE SEMI-CONDUCTEURS ET APPAREIL ASSOCIE
Abstract
(EN)
This disclosure is directed to a method of producing a smooth surface for a dielectric coating (34) that is located above the surface of semiconductor substrate (10) containing doped regions (26, 32, 34) of a semiconductor device. Sharp edges (40, 42) formed in the dielectric coating (34) during certain semiconductor processing steps are removed using a deposition process to deposit a separate insulating layer (48) on the dielectric coating (34) containing the sharp edges (40, 42) followed by an annealing operation and the subsequent removal of the separate insulating layer (48) to permit the subsequent formation of electrodes (50, 52, 54) on a smooth surface of the dielectric coating (34).
(FR)
Procédé de lissage de la surface d'un revêtement diélectrique (34) situé au-dessus de la surface du substrat d'un semi-conducteur (10) contenant des régions dopées (26, 32, 34). Les angles vifs (40, 42) formés dans le revêtement lors de certaines étapes de sa mise en place sont éliminés par un procédé assurant le dépôt d'une couche isolante séparée (48) recouvrant le diélectrique (34) présentant des angles vifs (40, 42), suivi d'un recuit puis de l'élimination de la couche isolante séparée (48) pour permettre la formation ultérieure d'électrodes (50, 52, 54) à la surface lisse du revêtement diélectrique (34).
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