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1. WO1996004611 - PRODUCTION OF A SUPPORT ELEMENT MODULE FOR EMBEDDING INTO SMART CARDS OR OTHER DATA CARRIER CARDS

Publication Number WO/1996/004611
Publication Date 15.02.1996
International Application No. PCT/EP1995/002150
International Filing Date 06.06.1995
Chapter 2 Demand Filed 09.02.1996
IPC
G06K 19/077 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
CPC
G06K 19/07745
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07745Mounting details of integrated circuit chips
G06K 19/07747
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07745Mounting details of integrated circuit chips
07747at least one of the integrated circuit chips being mounted as a module
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/45124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
45124Aluminium (Al) as principal constituent
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
Applicants
  • INTERNATIONAL BUSINESS MACHINES CORPORATION [US/US]; Old Orchard Road Armonk, NY 10504, US (AllExceptUS)
  • DRUSCHKE, Frank [DE/DE]; DE (UsOnly)
  • DIEMER, Roland [DE/DE]; DE (UsOnly)
  • ELSNER, Gerhard [DE/DE]; DE (UsOnly)
  • SCHMID, Wolfgang [DE/DE]; DE (UsOnly)
  • BRAUN, Reinhold [DE/DE]; DE (UsOnly)
  • GRUBER, Harald [DE/DE]; DE (UsOnly)
  • BECK, Wolfgang [DE/DE]; DE (UsOnly)
  • KRATZERT, Rainer [DE/DE]; DE (UsOnly)
Inventors
  • DRUSCHKE, Frank; DE
  • DIEMER, Roland; DE
  • ELSNER, Gerhard; DE
  • SCHMID, Wolfgang; DE
  • BRAUN, Reinhold; DE
  • GRUBER, Harald; DE
  • BECK, Wolfgang; DE
  • KRATZERT, Rainer; DE
Agents
  • SCHÄFER, Wolfgang; IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht D-70548 Stuttgart, DE
Priority Data
P 44 27 309.602.08.1994DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) HERSTELLUNG EINES TRÄGERELEMENTMODULS ZUM EINBAU IN CHIPKARTEN ODER ANDERE DATENTRÄGERKARTEN
(EN) PRODUCTION OF A SUPPORT ELEMENT MODULE FOR EMBEDDING INTO SMART CARDS OR OTHER DATA CARRIER CARDS
(FR) PRODUCTION D'UN MODULE D'ELEMENT DE SUPPORT A MONTER DANS DES CARTES A PUCES OU D'AUTRES CARTES A SUPPORTS DE DONNEES
Abstract
(DE)
Es wird ein Verfahren zur Herstellung eines IC-Moduls beschrieben, das aus einem dünnen Trägerelement (4) und einem darauf montierten Halbleiter-Chip (2) besteht. Dieses Verfahren erlaubt auch die Verwendung von IC-Bausteinen (2) besonders großer Abmessungen (Makro-Chips) und großer Typenvielfalt. Der Chip-Spritzpreßprozeß ist so dabei ausgelegt, daß eine minimale Bauhöhe, ohne daß eine Nacharbeitung erforderlich ist, erzielt werden kann und dadurch die kostengünstige Oberflächenmontierung der Chips verwendet werden kann. Dieses erfindungsgemäß hergestellte Modul läßt sich sowohl in flexiblen Schaltkreiskarten (Einsatz in z.B. Fotoapparaten) als auch in Chipkarten verwenden. Das erfindungsgemäße Verfahren weist dabei einen ersten Schritt des Aufbringens des mindestens einen IC-Bausteins (2) auf das Trägerelement (4), einen zweiten Schritt des Kontaktierens des mindestens einen IC-Bausteins (2) mit dem Trägerelement (4) und einen dritten Schritt des Spritzpressens einer Spritzpressmasse (18) zur Ummantelung des IC-Bausteins (2) auf.
(EN)
A process is disclosed for producing an IC-module that consists of a thin support element (4) upon which is mounted a semiconductor chip (2). This process also allows the use of IC-components (2) of especially large sizes (macrochips) and various types. The chip is injection moulded so that it has a minimum height without requiring further processing and may be economically surface-mounted. The module may be used both in flexible printed circuit cards (for example in photographic cameras) and in smart cards. In a first step of the process, at least one IC-component (2) is applied on the support element (4), in a second step the IC-component (2) is contacted with the support element (4) and in a third step an injection moulding material (18) is injection moulded around the IC-component (2) so as to envelop it.
(FR)
L'invention concerne un procédé de production d'un module à circuits intégrés constitué d'un mince élément de support (4) sur lequel est montée une puce semi-conductrice (2). Ce procédé permet d'utiliser des composants à circuits intégrés (2) de dimensions particulièrement élevées (macro-puces) et de types très divers. Le procédé de moulage par injection des puces permet d'obtenir sans traitements ultérieurs des puces avec une hauteur minimale, de sorte que les puces puissent être économiquement montées en surface. Le module ainsi produit peut être utilisé aussi bien dans des cartes souples à circuits imprimés (par exemple dans des appareils photos) que dans des cartes à puces. Pendant une première étape du procédé, au moins un composant à circuits intégrés (2) est appliqué sur l'élément de support (4), pendant une deuxième étape le composant à circuits intégrés (2) est mis en contact avec l'élément de support (4) et pendant une troisième étape une masse à mouler par injection (18) est moulée par injection de manière à envelopper le composant à circuits intégrés (2).
Also published as
Latest bibliographic data on file with the International Bureau