Processing

Please wait...

Settings

Settings

1. WO1996004329 - FLOWABLE SEALING RESIN COMPOSITION

Publication Number WO/1996/004329
Publication Date 15.02.1996
International Application No. PCT/JP1994/001294
International Filing Date 04.08.1994
IPC
C08G 59/62 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
62Alcohols or phenols
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
CPC
C08G 59/621
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
62Alcohols or phenols
621Phenols
H01L 23/293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
293Organic, e.g. plastic
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • HOKURIKU TORYO KABUSHIKI KAISYA [JP/JP]; 3993, Nigorikawa Niigata-shi Niigata 950-31, JP (AllExceptUS)
  • HOMMA, Yoshinobu [JP/JP]; JP (UsOnly)
  • FUJIKI, Tatsuhiro [JP/JP]; JP (UsOnly)
  • KITAMURA, Masahiro [JP/JP]; JP (UsOnly)
  • IKARASHI, Yasumi [JP/JP]; JP (UsOnly)
Inventors
  • HOMMA, Yoshinobu; JP
  • FUJIKI, Tatsuhiro; JP
  • KITAMURA, Masahiro; JP
  • IKARASHI, Yasumi; JP
Agents
  • TSUKUNI, Hajime; Svax TS Building 22-12, Toranomon 1-chome Minato-ku Tokyo 105, JP
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) FLOWABLE SEALING RESIN COMPOSITION
(FR) COMPOSITION COULANTE DE RESINE A SCELLER
Abstract
(EN)
A flowable sealing resin composition comprising (A) a liquid epoxy resin, (B) a compound represented by general formula (1) or (2), (C) a cure accelerator, and (D) a filler and/or a coloring agent, wherein the viscosity of a mixture of components (A) and (B) is 10-200 dPa.s at 25 °C, and the ratio of the volume fraction of a mixture of components (A) and (B) to that of component (D) is 80:20 to 50:50. In the said formulae, 0 « x < 2 on average and the content of the compound of formula (1) where x = 0 is 30 wt.% or above.
(FR)
L'invention concerne une composition coulante de résine à sceller comprenant (A) une résine époxy liquide, (B) un composé représenté par la formule générale (1) ou (2), (C) un accelérateur de durcissement, et (D) une charge et/ou un agent colorant, dans laquelle la viscosité d'un mélange des constituants (A) et (B) est égale à 10-200 dPa.s à 25 °C, et le rapport de la fraction volumique d'un mélange des constituants (A) et (B) à celle du constituant (D) est de 80:20 à 50:50. Dans les formules précitées, 0 « x < 2 en moyenne, et la teneur du composé de formule (1) où x = 0 est égale ou supérieure à 30 % en poids.
Latest bibliographic data on file with the International Bureau