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1. WO1996003851 - MICRORIDGE ABRASION FOR SELECTIVE METALIZATION

Publication Number WO/1996/003851
Publication Date 08.02.1996
International Application No. PCT/US1995/009224
International Filing Date 21.07.1995
Chapter 2 Demand Filed 06.02.1996
IPC
H01R 13/03 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/7087
02Contact members
03characterised by the material, e.g. plating or coating materials
H05K 1/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 3/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
04the conductive material being removed mechanically, e.g. by punching
H05K 3/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
CPC
H01R 13/03
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
02Contact members
03characterised by the material, e.g. plating, or coating materials
H01R 13/035
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
02Contact members
03characterised by the material, e.g. plating, or coating materials
035Plated dielectric material
H05K 1/0284
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0284Details of three-dimensional rigid printed circuit boards
H05K 1/119
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
119Details of rigid insulating substrates therefor, e.g. three-dimensional details
H05K 2201/09036
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09009Substrate related
09036Recesses or grooves in insulating substrate
H05K 2201/09045
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09009Substrate related
09045Locally raised area or protrusion of insulating substrate
Applicants
  • MINNESOTA MINING AND MANUFACTURING COMPANY [US/US]; P.O. Box 33427 St. Paul, MN 55133-3427, US
Inventors
  • BIERNATH, Rolf, W.; US
Agents
  • BRUESS, Steven, C.; Merchant, Gould, Smith, Edell, Welter & Schmidt 3100 Norwest Center 90 South Seventh Street Minneapolis, MN 55402, US
Priority Data
08/279,44225.07.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MICRORIDGE ABRASION FOR SELECTIVE METALIZATION
(FR) ABRASION DE MICRO-NERVURES POUR EFFECTUER UNE METALLISATION SELECTIVE
Abstract
(EN)
A process for selective metalization for electrically isolating areas of a substrate (40) is disclosed. The process employs placing microridges (60) onto a surface (42), the microridge (60) protruding from the plane formed by the surface (42). The surface (42), including the microridge (60), is then metalized (66) and a portion of the metalized microridge (60) beyond the surface plane (42) is removed. This removal process creates electrically isolated areas (68) without affecting the integrity of the substrate (40).
(FR)
L'invention concerne un procédé de métallisation sélective servant à isoler électriquement des zones d'un substrat (40). Ce procédé consiste à placer sur une surface (42) des micro-nervures (60) qui dépassent du plan constitué par ladite surface (42). On métallise (66) ensuite la surface (42), y compris les micro-nervures (60) et on enlève une partie des micro-nervures métallisées (60) dépassant du plan de la surface (42). Ce procédé de suppression permet de créer des zones (68) isolées électriquement sans porter atteinte à l'intégrité du substrat (40).
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