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1. (WO1996003771) METHOD OF MANUFACTURING A COMPOSITE STRUCTURE FOR USE IN ELECTRONIC DEVICES AND STRUCTURE, MANUFACTURED BY SAID METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1996/003771    International Application No.:    PCT/GB1995/001630
Publication Date: 08.02.1996 International Filing Date: 11.07.1995
Chapter 2 Demand Filed:    22.02.1996    
IPC:
H01L 21/48 (2006.01), H01L 23/538 (2006.01), H05K 3/02 (2006.01)
Applicants: MICRO COMPONENTS & SYSTEMS LTD. [IL/IL]; Mobile Post, 20179 Misgav (IL).
HOWDEN, Christopher, Andrew [GB/GB]; (GB)
Inventors: NEFTIN, Simon; (IL)
Common
Representative:
HOWDEN, Christopher, Andrew; Forrester Ketley & Co., Forrester House, 52 Bounds Green Road, London N11 2EY (GB)
Priority Data:
110431 25.07.1994 IL
Title (EN) METHOD OF MANUFACTURING A COMPOSITE STRUCTURE FOR USE IN ELECTRONIC DEVICES AND STRUCTURE, MANUFACTURED BY SAID METHOD
(FR) PROCEDE DE FABRICATION D'UNE STRUCTURE COMPOSITE S'ADAPTANT A DES DISPOSITIFS ELECTRONIQUES ET PROCEDE DE FABRICATION
Abstract: front page image
(EN)A method of manufacturing of a composite microelectronic structure with improved planarity of layers thereof. The method comprises masking of selected portion of electrically conductive layers with subsequent selective electrochemical anodic oxidation thereof and removing the mask. A composite structure, in particular MCM-D's manufactured by this method has improved connectivity density and performances.
(FR)L'invention se rapporte à un procédé de fabrication d'une structure micro-électronique composite dont la planarité des couches est améliorée. Le procédé consiste à masquer une partie sélectionnée des couches électroconductrices de cette structure. Une structure composite, en particulier le module multipuce MCM-D, fabriquée par ce procédé, présente une meilleure densité de connectivité et de meilleures performances.
Designated States: AM, AT, AU, BB, BG, BR, BY, CA, CH, CN, CZ, DE, DK, ES, FI, GB, GE, HU, JP, KE, KG, KP, KR, KZ, LK, LT, LU, LV, MD, MG, MN, MW, NO, NZ, PL, PT, RO, RU, SD, SE, SI, SK, TJ, TT, UA, UZ, VN.
African Regional Intellectual Property Organization (KE, MW, SD, SZ, UG)
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)