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1. WO1996003466 - PASTE OR PRINTABLE INK COMPOSITIONS

Publication Number WO/1996/003466
Publication Date 08.02.1996
International Application No. PCT/GB1995/001763
International Filing Date 26.07.1995
Chapter 2 Demand Filed 27.02.1996
IPC
C03C 8/16 2006.01
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
8Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
16with vehicle or suspending agents, e.g. slip
C09D 11/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
C09D 11/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
02Printing inks
H01B 1/16 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
14Conductive material dispersed in non-conductive inorganic material
16the conductive material comprising metals or alloys
H01L 23/498 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
CPC
C03C 8/16
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
8Enamels; Glazes
14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
16with vehicle or suspending agents, e.g. slip
C09D 11/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
02Printing inks
C09D 11/52
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
52Electrically conductive inks
H01B 1/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
14Conductive material dispersed in non-conductive inorganic material
16the conductive material comprising metals or alloys
H01L 23/49883
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49866characterised by the materials
49883the conductive materials containing organic materials or pastes, e.g. for thick films
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • COOKSON MATTHEY CERAMICS & MATERIALS LIMITED [GB/GB]; 130 Wood Street London EC2V 6EQ, GB (AllExceptUS)
  • CLIFFORD, John, Francis [GB/GB]; GB (UsOnly)
  • WATTS, Jennifer, Clare [GB/GB]; GB (UsOnly)
Inventors
  • CLIFFORD, John, Francis; GB
  • WATTS, Jennifer, Clare; GB
Agents
  • BOULT WADE & TENNANT; 27 Furnival Street London EC4A 1PQ, GB
Priority Data
9415075.227.07.1994GB
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PASTE OR PRINTABLE INK COMPOSITIONS
(FR) COMPOSITIONS DE PATES OU D'ENCRES D'IMPRIMERIE
Abstract
(EN)
A water-based paste or ink composition which comprises at least one powdered or flaked material and a transient carrier vehicle which is an aqueous medium including therein at least one associative thickener (as hereinbefore defined), the amounts of the powdered or flaked material, the vehicle and any optional additives included in the composition being chosen so that the composition has an appropriate rheology for it to be dispensed or printed and the transient carrier vehicle being removable from the composition by heating or pyrolysis to leave no or substantially no residues.
(FR)
Composition de pâte ou d'encre à base aqueuse comprenant au moins un matériau en poudre ou en flocons et un véhicule transitoire qui est un milieu aqueux contenant au moins un épaississant associatif (défini ci-avant), les quantités du matériau en poudre ou en flocons, du véhicule et de tous additifs éventuels contenus dans la composition étant sélectionnées de telle manière que ladite composition présente une rhéologie appropriée permettant de l'appliquer ou de l'imprimer et le véhicule transitoire pouvant être supprimé de ladite composition par réchauffement ou par pyrolyse, de façon à ne laisser pratiquement aucun résidu.
Also published as
Latest bibliographic data on file with the International Bureau