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1. WO1996003021 - REMOVABLE COMPUTER PERIPHERAL CARDS HAVING A SOLID ONE-PIECE HOUSING AND METHOD OF MANUFACTURING THE SAME

Publication Number WO/1996/003021
Publication Date 01.02.1996
International Application No. PCT/US1995/008750
International Filing Date 12.07.1995
IPC
G06F 1/18 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
18Packaging or power distribution
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
H05K 5/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
02Details
CPC
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2924/19041
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
1901Structure
1904Component type
19041being a capacitor
H01L 2924/3025
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
30Technical effects
301Electrical effects
3025Electromagnetic shielding
H05K 2203/1316
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
13Moulding and encapsulation; Deposition techniques; Protective layers
1305Moulding and encapsulation
1316Moulded encapsulation of mounted components
H05K 3/284
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
284for encapsulating mounted components
H05K 5/0269
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
02Details
0256of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
026having standardized interfaces
0265of PCMCIA type
0269Card housings therefor, e.g. covers, frames, PCB
Applicants
  • NATIONAL SEMICONDUCTOR CORPORATION [US/US]; 1090 Kifer Road, M/S 16-135 Sunnyvale, CA 95086-3737, US
Inventors
  • TAKIAR, Hem, P.; US
  • PATTERSON, Michael, W.; US
Agents
  • RODDY, Richard, J.; National Semiconductor Corporation 1090 Kifer Road, M/S 16-135 Sunnyvale, CA 94086-3737, US
Priority Data
08/275,98515.07.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) REMOVABLE COMPUTER PERIPHERAL CARDS HAVING A SOLID ONE-PIECE HOUSING AND METHOD OF MANUFACTURING THE SAME
(FR) CARTES PERIPHERIQUES INFORMATIQUES AMOVIBLES A BOITIER MONOBLOC SOLIDE ET LEUR PROCEDE DE FABRICATION
Abstract
(EN)
A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the portable peripheral card is a PCMCIA card. Methods of manufacturing such peripheral cards are also disclosed.
(FR)
Une carte périphérique portable pour un dispositif électrique comporte un boîteir moulé par injection. Selon un aspect de l'invention, la carte périphérique possède une carte de circuit imprimé, un raccord électrique femelle et un boîtier moulé par injection, monobloc et solide. Des composants électriques sont montés sur la carte de circuit imprimé et le raccord femelle est fixé à la carte du circuit imprimé pour permettre les communications entre les composants électriques montés sur la carte du circuit imprimé et le dispositif électrique. Le boîtier monobloc solide renferme la carte du circuit imprimé et les composants électriques, et expose de plus une partie du raccord électrique pour faciliter les connexions électriques entre la carte du circuit imprimé et le dispositif électrique. Selon un mode de réalisation préféré, la carte périphérique portable est une carte PCMCIA. L'invention se rapporte à des procédés de fabrication de ces cartes périphériques.
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