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1. WO1996002959 - ELECTRICAL CONNECTIONS WITH DEFORMABLE CONTACTS

Publication Number WO/1996/002959
Publication Date 01.02.1996
International Application No. PCT/US1995/009201
International Filing Date 19.07.1995
Chapter 2 Demand Filed 07.02.1996
IPC
H01R 13/24 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/7087
02Contact members
22Contacts for co-operating by abutting
24resilient; resiliently mounted
H01R 43/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
02for soldered or welded connections
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 1/05 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated metal substrate
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
CPC
H01R 12/714
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70Coupling devices
71for rigid printing circuits or like structures
712co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
714with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
H01R 13/2414
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
02Contact members
22Contacts for co-operating by abutting
24resilient; resiliently-mounted
2407characterized by the resilient means
2414conductive elastomers
H05K 1/0272
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0272Adaptations for fluid transport, e.g. channels, holes
H05K 1/036
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
0353consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
036Multilayers with layers of different types
H05K 1/056
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated ; conductive substrates, e.g. insulated; metal substrate
056the metal substrate being covered by an organic insulating layer
H05K 1/116
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
115Via connections; Lands around holes or via connections
116Lands, clearance holes or other lay-out details concerning the surrounding of a via
Applicants
  • TESSERA, INC. [US/US]; 3099 Orchard Drive San Jose, CA 95134, US
Inventors
  • DISTEFANO, Thomas, H.; US
  • SMITH, John, W.; US
  • KARAVAKIS, Konstantine; US
  • KOVAK, Zlata; US
  • FJELSTAD, Joseph; US
Agents
  • MILLET, Marcus, J. ; Lerner, David, Littenberg, Krumholz & Mentlik 600 South Avenue West Westfield, NJ 07090, US
Priority Data
08/277,33619.07.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTRICAL CONNECTIONS WITH DEFORMABLE CONTACTS
(FR) CONNEXIONS ELECTRIQUES AVEC CONTACTS DEFORMABLES
Abstract
(EN)
An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.
(FR)
Cette invention se rapporte à une pièce intercalaire, qui sert à établir une interconnexion entre des panneaux à circuits microélectroniques (260) et qui, à cet effet, comporte des contacts (250) sur ces surfaces. Chaque contact présente un axe central perpendiculaire à ladite surface et une partie périphérique conçue pour s'étendre radialement vers l'extérieur à partir dudit axe central en réaction à une force appliquée par un plot de connexion (262) sur le panneau à circuits avec lequel il est entré en contact. Ainsi, lorsque les panneaux à circuits (260) sont comprimés au moyen des pièces intercalaires, les contacts s'étendent radialement et parcourent les plots de contact (262) en exerçant un frottement sur eux. Ce frottement facilite le soudage des contacts sur les plots de connexion, au moyen du matériau de soudage conducteur (246) porté par les contacts eux-mêmes.
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