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1. WO1996002955 - PROCESS FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION

Publication Number WO/1996/002955
Publication Date 01.02.1996
International Application No. PCT/DE1995/000830
International Filing Date 27.06.1995
Chapter 2 Demand Filed 09.11.1995
IPC
H01R 4/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
04using electrically conductive adhesives
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
H05K 3/36 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
36Assembling printed circuits with other printed circuits
CPC
H01R 4/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
04using electrically conductive adhesives
H05K 1/181
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
181associated with surface mounted components
H05K 2201/0129
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0104Properties and characteristics in general
0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
H05K 2201/09881
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
09881Coating only between conductors, i.e. flush with the conductors
H05K 2201/10674
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10613Details of electrical connections of non-printed components, e.g. special leads
10621Components characterised by their electrical contacts
10674Flip chip
H05K 2201/10984
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10613Details of electrical connections of non-printed components, e.g. special leads
10954Other details of electrical connections
10984Component carrying a connection agent, e.g. solder, adhesive
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE] (AllExceptUS)
  • GRÜNWALD, Werner [DE]/[DE] (UsOnly)
  • HAUG, Ralf [DE]/[DE] (UsOnly)
  • BURKHART, Thomas [DE]/[DE] (UsOnly)
  • MENNIG, Martin [DE]/[DE] (UsOnly)
  • SCHMIDT, Helmut [DE]/[DE] (UsOnly)
Inventors
  • GRÜNWALD, Werner
  • HAUG, Ralf
  • BURKHART, Thomas
  • MENNIG, Martin
  • SCHMIDT, Helmut
Priority Data
P 44 24 831.814.07.1994DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUR HERSTELLUNG EINER ELEKTRISCH LEITENDEN VERBINDUNG
(EN) PROCESS FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION
(FR) PROCEDE DE REALISATION D'UNE CONNEXION ELECTRO-CONDUCTRICE
Abstract
(DE)
Die Erfindung betrifft ein Verfahren zur Herstellung einer elektrisch leitenden Verbindung zwischen gegenüberliegenden Kontaktbereichen von zwei zu verbindenden Elementen mittels eines in einem thermoplastischen Basismaterial dispergierten, elektrisch leitfähige Teilchen aufweisenden Schmelzklebers. Es ist vorgesehen, daß der Schmelzkleber (22) gezielt ausschließlich auf die Kontaktbereiche (16) wenigstens eines der Elemente (10, 28, 42, 50) aufgebracht wird und diese unter Wärmeeinwirkung gefügt werden.
(EN)
The invention relates to a process for producing an electrically conductive connection between opposite contact regions of two components to be joined by means of a hot-melt adhesive with electrically conductive particles dispersed in a thermoplastic base material. The hot-melt adhesive (22) is deliberately applied only to the contact regions (16) of at least one of the components (10, 28, 42, 50), which are put together under the effect of heat.
(FR)
L'invention concerne un procédé permettant de réaliser une connexion électro-conductrice entre les zones de contact superposées de deux éléments à raccorder, à l'aide d'une colle à fusion comportant des particules électro-conductrices et dispersée dans un matériau de base thermoplastique. Il est prévu de appliquer de manière ciblée la colle fusion (22) exclusivement sur les zones de contact (16) d'au moins un des éléments (10, 28, 42, 50) et d'assembler lesdits éléments sous l'effet de la chaleur.
Also published as
Latest bibliographic data on file with the International Bureau