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1. WO1996002943 - THERMALLY ENHANCED LEADFRAME

Publication Number WO/1996/002943
Publication Date 01.02.1996
International Application No. PCT/US1995/009022
International Filing Date 17.07.1995
Chapter 2 Demand Filed 20.02.1996
IPC
H01L 23/495 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
495Lead-frames
CPC
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/49171
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4912Layout
49171Fan-out arrangements
H01L 23/49503
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49503characterised by the die pad
H01L 23/49541
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49541Geometry of the lead-frame
H01L 23/49568
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49568specifically adapted to facilitate heat dissipation
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
Applicants
  • ANALOG DEVICES, INC. [US/US]; One Technology Way Norwood, MA 02062, US
Inventors
  • MOORE, Thomas, D.; IE
Agents
  • GIFFORD, Eric, A.; Koppel & Jacobs Suite 302 31255 Cedar Valley Drive Westlake Village, CA 91362-4031, US
Priority Data
08/277,32419.07.1994US
08/445,03619.05.1995US
08/445,03719.05.1995US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THERMALLY ENHANCED LEADFRAME
(FR) GRILLE DE CONNEXION AMELIOREE THERMIQUEMENT
Abstract
(EN)
A leadframe that exhibits improved thermal dissipation and that can be incorporated into standard integrated circuit (IC) packages is provided by increasing the thermal cross section between the leadframe paddle (22) and the lead fingers (leads) (26) so that the leads (26) are utilized for conducting a significant amount of heat away from the IC (21). A larger thermal cross section can be achieved by making the shape of the paddle perimeter (24) nonlinear to increase the surface area of its edge. In the preferred embodiment, the paddle perimeter (24) has a 'serpentine' shape and the inner ends (28) of the leads (26) are placed in close proximity to the paddle perimeter (24) and are shaped to substantially follow its serpentine shape. The shaped paddle (22) and lead ends (28) increase the thermal cross section between the paddle (22) and the leads (26), resulting in improved thermal conduction. The leads (26) conduct the heat to the outside of the package, where it is dissipated into the circut board on which the leadframe package is mounted. For a package with a large number of leads, the paddle perimeter preferably has a saw-tooth shape, with at least some of the leads positioned between adjacent teeth.
(FR)
On obtient une grille de connexion présentant une dissipation thermique améliorée et pouvant être insérée dans des boîtiers de circuit intégré (CI) standard en augmentant la section efficace thermique entre la barrette (22) de la grille de connexion et les doigts conducteurs (conducteurs)(26), de sorte que ceux-ci puissent être utilisés pour évacuer une quantité considérable de chaleur du circuit intégré (21). On obtient une section efficace thermique plus importante en donnant une forme non linéaire au contour (24) de la barrette de manière à augmenter la surface de son bord. Dans le mode de réalisation préféré, le périmètre de la barrette (24) présente une forme de serpentin, et les extrémités internes (28) des conducteurs (26) sont placées très près de cette dernière et épousent les contours du serpentin. La barrette conformée (22) et les extrémités (28) des conducteurs augmentent la section efficace thermique entre la barrette (22) et les conducteurs (26), ce qui a pour effet d'améliorer la conduction thermique. Les conducteurs (26) acheminent la chaleur à l'extérieur du boîtier, ladite chaleur étant dissipée dans la plaquette sur laquelle le boîtier de la grille de connexion est montée. Lorsque le boîtier présente un grand nombre de conducteurs, le périmètre de la barrette est en dents de scie, au moins certains des conducteurs étant placés entre les dents adjacentes.
Also published as
Latest bibliographic data on file with the International Bureau