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1. WO1996002941 - METAL COVER FOR CERAMIC PACKAGE AND METHOD OF MAKING SAME

Publication Number WO/1996/002941
Publication Date 01.02.1996
International Application No. PCT/US1995/009124
International Filing Date 19.07.1995
IPC
H01L 23/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape
H01L 23/10 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
10characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
CPC
H01L 23/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
H01L 23/10
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
10characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/01079
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01079Gold [Au]
Applicants
  • JOHNSON MATTHEY ELECTRONICS, INC. [US/US]; East 15128 Euclid Avenue Spokane, WA 99216, US
Inventors
  • LI, Jianxing; US
Agents
  • GIOIA, Vincent, G.; Christie, Parker & Hale P.O. Box 7068 Pasadena, CA 91109-7068, US
Priority Data
08/277,14519.07.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METAL COVER FOR CERAMIC PACKAGE AND METHOD OF MAKING SAME
(FR) COUVERCLE METALLIQUE POUR BOITIER EN CERAMIQUE ET PROCEDE DE FABRICATION CORRESPONDANT
Abstract
(EN)
A solderable metallic cover for hermetically sealing a ceramic package that includes an iron or iron-alloy core and layers of nickel or nickel alloy on the core and palladium or palladium alloy on the nickel layer.
(FR)
Cette invention se rapporte à un couvercle métallique brasable servant à sceller hermétiquement un boîtier en céramique, ce couvercle contenant un noyau en fer ou en alliage de fer, ainsi qu'une couche de nickel ou d'alliage de nickel recouvrant le noyau et une couche de palladium ou d'alliage de palladium recouvrant ladite couche de nickel.
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