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1. WO1996002848 - THREE AXIS PACKAGING

Publication Number WO/1996/002848
Publication Date 01.02.1996
International Application No. PCT/US1995/009183
International Filing Date 20.07.1995
Chapter 2 Demand Filed 16.02.1996
IPC
G01R 33/02 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
33Arrangements or instruments for measuring magnetic variables
02Measuring direction or magnitude of magnetic fields or magnetic flux
H01L 23/538 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H05K 1/05 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated metal substrate
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
CPC
G01R 33/0206
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
33Arrangements or instruments for measuring magnetic variables
02Measuring direction or magnitude of magnetic fields or magnetic flux
0206Three-component magnetometers
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 23/5387
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5387Flexible insulating substrates
H05K 1/05
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated ; conductive substrates, e.g. insulated; metal substrate
H05K 1/118
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
118specially for flexible printed circuits, e.g. using folded portions
Applicants
  • HONEYWELL INC. [US/US]; Honeywell Plaza Minneapolis, MN 55408, US
Inventors
  • PANT, Bharat, B.; US
  • SPIELBERGER, Richard, K.; US
Agents
  • BRUNS, Gregory, A.; Honeywell Inc. Honeywell Plaza - MN12-8251 Minneapolis, MN 55408, US
Priority Data
08/277,84720.07.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THREE AXIS PACKAGING
(FR) ENCAPSULATION TRIAXIALE
Abstract
(EN)
Apparatus for mounting and making electrical connections to sensor devices (S1, S2, S3) for use in three axis sensing including a flexible circuit (20) and a substrate (30) shaped so that when a portion of the flexible tape (20) is secured to the substrate (30) the sensor devices (S1, S2, S3) can be mounted on the substrate (30) for sensing in the desired three directions. The sensors are connected to conductors in the flexible tape by wirebonds or by other means.
(FR)
Cette invention se rapporte à un appareil pour monter et établir des connexions électriques dans des dispositifs à capteurs (S1, S2, S3) destinés à être utilisés dans des opérations de détection selon trois axes. A cet effet, cet appareil comprend un circuit flexible (20) et un substrat (30) conçu pour que, au moment où une partie de la bande flexible (20) est fixée au substrat (30), les dispositifs capteurs (S1, S2, S3) puissent être montés sur le substrat (30) pour exercer leur fonction de détection dans les trois directions désirées. Les capteurs sont connectés aux conducteurs dans la bande flexible par des soudures par fils ou par d'autres moyens.
Also published as
Latest bibliographic data on file with the International Bureau