Processing

Please wait...

Settings

Settings

1. WO1996002687 - ELECTROLYTIC PLATING APPARATUS AND METHOD

Publication Number WO/1996/002687
Publication Date 01.02.1996
International Application No. PCT/US1994/008309
International Filing Date 19.07.1994
Chapter 2 Demand Filed 12.02.1996
IPC
C25D 5/04 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
04Electroplating with moving electrodes
C25D 7/12 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7Electroplating characterised by the article coated
12Semiconductors
C25D 21/10 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
10Agitating of electrolytes; Moving of racks
CPC
C25D 17/001
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
001Apparatus specially adapted for plating wafers, e.g. semiconductors, solar cells
C25D 21/10
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
21Processes for servicing or operating cells for electrolytic coating
10Agitating of electrolytes; Moving of racks
C25D 5/04
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
04Electroplating with moving electrodes
C25D 7/12
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
7Electroplating characterised by the article coated
12Semiconductors
Applicants
  • AMERICAN PLATING SYSTEM, INC. [US/US]; 2150 Maple Privado Street Ontario, CA 91761, US (AllExceptUS)
  • LOWERY, Kenneth, J. [US/US]; US (UsOnly)
Inventors
  • LOWERY, Kenneth, J.; US
Agents
  • KELBON, Marcia, S.; Christensen, O'Connor, Johnson & Kindness Suite 2800 1420 Fifth Avenue Seattle, WA 98101-2347, US
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTROLYTIC PLATING APPARATUS AND METHOD
(FR) DISPOSITIF ET PROCEDE DE PLACAGE ELECTROLYTIQUE
Abstract
(EN)
An apparatus (10) for electrolytic plating of a substrate (44) includes a tank (14) in which a shaft (30) is centrally mounted for rotation about a first axis (28). The shaft carries an arm (40), on the distal end (112) of which is rotatably mounted a fixture wheel (44). The substrate to be plated is carried on the fixture wheel, which rides on an annular track (50) formed on the bottom of the tank around the shaft. A plurality of spaced pins (52) projecting upwardly from the track engage with a plurality of spaced recesses (56) formed about the perimeter (54) of the wheel, so that the wheel rotates about a second axis (64) while revolving around the first axis. The fixture carries a plurality of electrical contact members (46) that contact the substrate. Each contact member is separately supplied with current from a multichannel power supply (22). For each electrical contact member, the fixture includes a separate corresponding conductive brush (162), bushing (142) and lead (48) threaded through the arm and shaft to the corresponding channel of the power supply.
(FR)
Dispositif (10) de placage électrolytique sur un substrat (44), comprenant une cuve (14) au centre de laquelle on a monté un arbre (30) destiné à tourner autour d'un premier axe (28). Cet arbre porte un bras (40) sur l'extrémité (112) distale duquel une roue (44) dotée d'éléments de fixation est montée rotative. Le substrat à plaquer est supporté par ladite roue qui suit un trajet (50) circulaire formé sur le fond de la cuve autour de l'arbre. Une pluralité d'ergots (52) espacés, saillant vers le haut à partir du trajet, s'engagent dans une pluralité d'évidements (56) espacés, ménagés sur le périmètre (54) de la roue de manière que celle-ci tourne autour d'un second axe (64) tout en tournant autour du premier axe. Les éléments de fixation de la roue comportent une pluralité de pièces (46) de raccordement électrique raccordant le substrat, chacune de ces pièces étant alimentées séparément par un courant provenant d'une alimentation (22) en énergie à canaux multiples. Pour chaque pièce de raccordement électrique, les éléments de fixation comprennent un balai (162) conducteur correspondant séparé, une traversée isolante (142) ainsi qu'un fil conducteur (48) relié à travers le bras et l'arbre au canal correspondant de l'alimentation en énergie.
Also published as
Latest bibliographic data on file with the International Bureau