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1. WO1996002362 - APPARATUS AND METHOD FOR DICING SEMICONDUCTOR WAFERS

Publication Number WO/1996/002362
Publication Date 01.02.1996
International Application No. PCT/US1995/010087
International Filing Date 20.07.1995
IPC
B28D 5/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/687 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
CPC
B28D 5/0052
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
0005by breaking, e.g. dicing
0052Means for supporting or holding work during breaking
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
H01L 21/67132
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67132Apparatus for placing on an insulating substrate, e.g. tape
H01L 21/68728
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68728characterised by a plurality of separate clamping members, e.g. clamping fingers
Y10T 225/325
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
225Severing by tearing or breaking
30Breaking or tearing apparatus
307Combined with preliminary weakener or with nonbreaking cutter
321Preliminary weakener
325With means to apply moment of force to weakened work
Y10T 225/371
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
225Severing by tearing or breaking
30Breaking or tearing apparatus
371Movable breaking tool
Applicants
  • LOOMIS INDUSTRIES, INC. [US/US]; 1210 Church Street St. Helena, CA 94574, US
Inventors
  • LOOMIS, James, W.; US
  • TWEEDIE, Richard, T.; US
Agents
  • ROSE, Howard, L.; Suite 601N 7315 Wisconsin Avenue Bethesda, MD 20814, US
Priority Data
08/277,62220.07.1994US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUS AND METHOD FOR DICING SEMICONDUCTOR WAFERS
(FR) APPAREIL ET PROCEDE DE DECOUPAGE DE TRANCHES SEMI-CONDUCTRICES
Abstract
(EN)
A wafer (64) to be diced to form chips is placed on the sticky side of a thin elastic film (26) in the form of a Swiss Cross which is secured to the side members of a compressed but expandable square frame (2), the frame being placed in a scribing and dicing machine (89) in its released state so that the frame and thus the film can expand during the dicing operation, further expansion being accomplished after dicing of the wafer by heating the film while in an expansion fixture (122) to insure removal of the chips from the film without damaging adjacent chips. The sticky material on the film may be rendered less sticky after formation of the chips by exposure to ultraviolet energy or the like.
(FR)
On place une tranche (64) destinée à être découpée en puces sur le côté collant d'un film élastique mince (26) en forme de croix suisse, fixé aux éléments latéraux d'un cadre carré comprimé mais déployable (2), ce cadre étant placé dans une machine à trancher et découper (89) dans son état de repos, de sorte que le cadre et par conséquent le film puissent se déployer pendant l'opération de découpage, une expansion supplémentaire se produisant après le découpage de la tranche par échauffement du film dans un support d'expansion (122) afin d'assurer que l'enlèvement des puces du film n'endommage pas les puces adjacentes. La matière collante sur le film peut être rendue moins collante après formation des puces, par exposition à une énergie ultraviolette ou similaire.
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