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1. WO1995033086 - ELECTROLYTIC METHOD AND DEVICE FOR THE CONTINUOUS AND UNIFORM METALLIZATION OR ETCHING OF METAL SURFACES

Publication Number WO/1995/033086
Publication Date 07.12.1995
International Application No. PCT/DE1995/000706
International Filing Date 26.05.1995
Chapter 2 Demand Filed 31.10.1995
IPC
C25D 5/00 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
C25F 3/02 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
3Electrolytic etching or polishing
02Etching
C25F 7/00 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
7Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
H05K 3/07 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
07being removed electrolytically
H05K 3/24 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing of the conductive pattern
CPC
C25D 21/00
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
C25D 7/0657
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
7Electroplating characterised by the article coated
06Wires; Strips; Foils
0614Strips or foils
0657Conducting rolls
C25F 3/02
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
3Electrolytic etching or polishing
02Etching
C25F 7/00
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
7Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects
H05K 3/07
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
07being removed electrolytically
H05K 3/241
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing the conductive pattern
241characterised by the electroplating method; means therefor, e.g. baths or apparatus
Applicants
  • ATOTECH DEUTSCHLAND GMBH [DE]/[DE] (AllExceptUS)
  • SCHNEIDER, Reinhard [DE]/[DE] (UsOnly)
Inventors
  • SCHNEIDER, Reinhard
Agents
  • EFFERT, Udo
Priority Data
P 44 18 278.326.05.1994DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN UND VORRICHTUNG ZUM KONTINUIERLICHEN GLEICHMÄSSIGEN ELEKTROLYTISCHEN METALLISIEREN ODER ÄTZEN
(EN) ELECTROLYTIC METHOD AND DEVICE FOR THE CONTINUOUS AND UNIFORM METALLIZATION OR ETCHING OF METAL SURFACES
(FR) PROCEDE ET DISPOSITIF DE METALLISATION OU D'ATTAQUE ELECTROLYTIQUE HOMOGENE ET CONTINUE
Abstract
(DE)
Die Erfindung betrifft ein Verfahren zum kontinuierlichen gleichmässigen elektrolytischen Metallisieren oder Ätzen von Metalloberflächen sowie eine zur Durchführung dieses Verfahrens geeignete Vorrichtung. Die Erfindung ist insbesondere zur Behandlung von Leiterplatten und Leiterfolien in Anlagen mit horizontalem Durchlauf des Behandlungsgutes geeignet. Um zu vermeiden, dass auf schmalen und breiten Leiterzügen an Leiterplatten unterschiedlich dicke Metallschichten abgeschieden werden, wird nach der vorliegenden Erfindung mit beweglichen, vorzugsweise rotierenden walzenförmigen Zwischenelektroden (22) gearbeitet, die in sehr geringem Wirkungsabstand über dem Behandlungsgut (19, 25) kurzschlussfrei abrollen oder diese wischend berühren. Diese Zwischenelektroden sind nicht an die Badstromquelle elektrisch angeschlossen und befinden sich zwischen der Oberfläche des Behandlungsgutes und einer geeigneten Gegenelektrode (21, 27).
(EN)
The invention concerns an electrolytic method for continuously and uniformly metallizing or etching metal surfaces, plus a device suitable for carrying out the method. The invention is particularly suitable for the treatment of circuit boards and conductor foils in installations in which the material passes through horizontally. In order to avoid metal films of differing thickness being deposited on narrow and wide conductor tracks on circuit boards, the invention calls for moving, preferably rotating, roller-shaped intermediate electrodes (22) to be used which roll over the material being treated (19, 25) at a very short distance from the material without causing a short-circuit or which touch the material with a wiping motion. The intermediate electrodes are not connected to the bath power supply and are located between the surface of the material being treated and a suitable counter-electrode (21, 27).
(FR)
L'invention concerne un procédé de métallisation ou d'attaque électrolytique homogène et continue de surfaces métalliques, ainsi qu'un dispositif approprié pour sa mise en ÷uvre. L'invention se prête en particulier au traitement de cartes de circuits imprimés et de feuilles conductrices dans des unités dans lesquelles le matériau à traiter passe horizontalement. Ce procédé permet d'éviter que des couches métalliques d'épaisseur différente ne se déposent sur les tracés conducteurs étroits et larges des cartes de circuits imprimés. A cet effet, ce procédé utilise des électrodes intermédiaires (22), mobiles, de préférence rotatives, de forme cylindrique, qui roulent au-dessus du matériau à traiter (19, 25), à très courte distance du matériau, sans provoquer de court-circuit, ou qui touchent le matériau dans un mouvement de balayage. Ces électrodes intermédiaires ne sont pas raccordées électriquement à la source de courant du bain et se trouvent entre la surface du matériau à traiter et une contre-électrode appropriée (21, 27).
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