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Machine translation
1. (WO1994015259) RESIN COMPOSITIONS FOR PHOTORESIST APPLICATIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1994/015259    International Application No.:    PCT/US1993/012404
Publication Date: 07.07.1994 International Filing Date: 20.12.1993
Chapter 2 Demand Filed:    27.07.1994    
IPC:
C08G 8/08 (2006.01), C08G 8/24 (2006.01), G03F 7/023 (2006.01)
Applicants: HOECHST CELANESE CORPORATION [US/US]; Route 202-206 North, Somerville, NJ 08876 (US)
Inventors: SOBODACHA, Chester, J.; (US).
LYNCH, Thomas, J.; (US).
DURHAM, Dana, L.; (US)
Agent: SAYKO, Andrew, F., Jr.; Hoechst Celanese Corporation, 86 Morris Avenue, Summit, NJ 07901 (US)
Priority Data:
07/999,529 29.12.1992 US
Title (EN) RESIN COMPOSITIONS FOR PHOTORESIST APPLICATIONS
(FR) COMPOSITIONS DE RESINE POUR PHOTORESIST
Abstract: front page image
(EN)A process for producing a water insoluble, aqueous alkali soluble novolak resin, process for producing a photoresist containing such a novolak resin and a method for producing a semiconductor device using such a photoresist.
(FR)Procédé de production d'une résine novolaque insoluble dans l'eau et soluble dans un liquide alcalin aqueux, procédé de production d'un photorésist contenant ladite résine novolaque et procédé de production d'un dispositif à semiconducteurs à l'aide dudit photorésist.
Designated States: JP, KR.
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: English (EN)
Filing Language: English (EN)