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1. WO1994003284 - SINGLE-CHAMBER CLEANING, RINSING AND DRYING APPARATUS

Publication Number WO/1994/003284
Publication Date 17.02.1994
International Application No. PCT/US1993/007147
International Filing Date 29.07.1993
Chapter 2 Demand Filed 28.02.1994
IPC
B08B 3/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
04Cleaning involving contact with liquid
10with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity, by vibration
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
B08B 3/10
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
04Cleaning involving contact with liquid
10with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity, by vibration
H01L 21/67028
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
Y10S 134/902
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
134Cleaning and liquid contact with solids
902Semiconductor wafer
Applicants
  • NAFZIGER, Charles, P. [US]/[US]
Inventors
  • NAFZIGER, Charles, P.
Agents
  • DURANDO, Antonio, R.
Priority Data
07/921,71730.07.1992US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SINGLE-CHAMBER CLEANING, RINSING AND DRYING APPARATUS
(FR) APPAREIL DE NETTOYAGE, RINÇAGE ET SECHAGE MONOCHAMBRE
Abstract
(EN)
A machine (100) that performs the steps of cleaning, rinsing and drying required prior to further processing in the course of conventional semiconductor fabrication in a single, hermetically and thermally insulated, process chamber (44). The machine consists of functionally compartmentalized sections connected to the process chamber for each specific function, comprising a cleaning-solution storage (72) and circulation section, a rinsing fluid storage (50) and circulation section, and a vacuum drying section (130). After enclosing the semiconductor product hermetically in the process chamber, a cleaning solution from an internal holding source is heated and circulated through it for the cleansing step, followed by purified water to rinse the cleaning fluid off the surface of the semiconductor material. A vacuum is then applied to completely remove any residue of rinsing water left on the wafers.
(FR)
Une machine (100) permet le nettoyage, le rinçage et le séchage nécessaires avant des opérations ultérieures au cours de la fabrication conventionnelle de semi-conducteurs, dans une seule chambre de traitement (44) étanche à isolation thermique. Cette machine comporte des sections à fonctions séparées raccordées à la chambre de traitement pour chaque fonction distincte et elle comprend une réserve (72) et une section de circulation destinées à la solution de nettoyage, une réserve (50) et une section de circulation destinées au fluide de rinçage (50) et une section de séchage, sous vide (130). Une fois le semi-conducteur enfermé hermétiquement dans la chambre de traitement, une solution de nettoyage provenant d'une réserve interne est chauffée et traverse cette chambre pendant la phase de nettoyage, précédant de l'eau purifiée destinée à rincer ce fluide de nettoyage à la surface du matériau semi-conducteur. On établit alors le vide pour éliminer totalement tout résidu d'eau de rinçage subsistant sur les tranches de semi-conducteurs.
Also published as
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