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1. (WO1994000880) SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1994/000880    International Application No.:    PCT/JP1993/000839
Publication Date: 06.01.1994 International Filing Date: 22.06.1993
Chapter 2 Demand Filed:    24.01.1994    
IPC:
H01L 23/051 (2006.01), H01L 23/08 (2006.01), H01L 23/49 (2006.01)
Applicants: KABUSHIKI KAISHA KOMATSU SEISAKUSHO [JP/JP]; 3-6, Akasaka 2-chome, Minato-ku, Tokyo 107 (JP) (For All Designated States Except US).
TABUCHI, Toshihiro [JP/JP]; (JP) (For US Only)
Inventors: TABUCHI, Toshihiro; (JP)
Agent: KIMURA, Takahisa; 6F, Ginza Daisaku Building, 11-2, Ginza 2-chome, Chuo-ku, Tokyo 104 (JP)
Priority Data:
4/43893 U 24.06.1992 JP
Title (EN) SEMICONDUCTOR DEVICE
(FR) COMPOSANT A SEMICONDUCTEUR
Abstract: front page image
(EN)This invention aims at providing a glass package type capacitor having high reliability and high resistance to heat and mechanical impact. In the glass package, a semiconductor device (2) is connected with a lead (5) through a conductor (8) having a bent structure.
(FR)Condensateur à enveloppe de verre présentant une résistance élevée à la chaleur et aux chocs mécaniques et une grande fiabilité. A l'intérieur de l'enveloppe en verre, le composant à semiconducteur (2) est connecté à un fil (5) par un conducteur (8) ayant un profil courbe.
Designated States: US.
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)