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1. WO1994000270 - LASER MACHINING APPARATUS

Publication Number WO/1994/000270
Publication Date 06.01.1994
International Application No. PCT/JP1993/000847
International Filing Date 22.06.1993
IPC
B23K 26/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
B23K 26/36 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
CPC
B23K 26/0622
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0622by shaping pulses
B23K 26/0853
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
083Devices involving movement of the workpiece in at least one axial direction
0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
Applicants
  • FANUC LTD [JP]/[JP] (AllExceptUS)
  • NAKATA, Yoshinori [JP]/[JP] (UsOnly)
  • OHARA, Kazuki [JP]/[JP] (UsOnly)
Inventors
  • NAKATA, Yoshinori
  • OHARA, Kazuki
Agents
  • HATTORI, Kiyoshi
Priority Data
4/16764125.06.1992JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER MACHINING APPARATUS
(FR) LASER DE DECOUPE
Abstract
(EN) A laser machining apparatus adapted to carry out a cutting process by applying a laser beam to a work. During the cutting of a work with a laser beam applied thereto, a corner portion is cut stably and reliably under actually effective machining conditions. The machining route (path) according to a program which is being executed currently is judged for its conformity with a corner portion, i.e. a point B (step S1), and, if it conforms, a cutting operation is carried out in a stepped manner in accordance with a machining condition M stored in a RAM 3 in advance (step S2). When the machining condition has reached the corner portion, i.e. the point B, it is set to a lower level or a level of zero, and then increased in a stepped manner up to normal machining conditions Mo with the machining position (time). When the cutting operation at the corner portion in the point B is completed, a normal cutting operation is carried out under the constant machining condition Mo (step S3). Accordingly, the cutting of the corner portion in the point B can be done stably and reliably under actually effective machining conditions.
(FR) Un laser de découpe permet de découper une pièce. Pendant l'application du faisceau laser à cette pièce, il est possible de pratiquer une découpe en angle de façon stable, sûre et à un rythme efficace. Le cheminement de découpe programmé (trajet) qui est suivi fait l'objet d'une vérification de conformité concernant la partie en angle, c'est-à-dire un point B (étape S1), et en cas de conformité, l'opération de découpe se déroule par étapes selon un rythme de découpe M mémorisée dans une RAM (3) (étape S2). Quand cette découpe atteint la partie en angle, c'est-à-dire le point B, l'appareil se règle sur une cadence inférieure ou une cadence zéro puis celle-ci s'accroît par étapes jusqu'à atteindre un rythme de découpe normal Mo conforme à la position de découpe (en fonction de la durée). Après achèvement de la découpe de la partie en angle au point B, l'opération normale de coupe intervient selon le rythme de découpe normal Mo (étape 3). En conséquence, la découpe de la partie en angle placée au point B peut se faire de façon stable, sûre et à un rythme efficace.
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