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1. WO1993005633 - MANUFACTURING METHOD FOR ELECTRICAL CIRCUIT BOARD

Publication Number WO/1993/005633
Publication Date 18.03.1993
International Application No. PCT/GB1992/001593
International Filing Date 28.08.1992
Chapter 2 Demand Filed 25.03.1993
IPC
H05K 1/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20by affixing prefabricated conductor pattern
H05K 3/30 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
CPC
H05K 1/0284
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0284Details of three-dimensional rigid printed circuit boards
H05K 1/119
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
119Details of rigid insulating substrates therefor, e.g. three-dimensional details
H05K 2201/09118
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09009Substrate related
09118Moulded substrate
H05K 2203/0113
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0104for patterning or coating
0113Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
H05K 2203/1476
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
14Related to the order of processing steps
1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
H05K 3/0014
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0011Working of insulating substrates or insulating layers
0014Shaping of the substrate, e.g. by moulding
Applicants
  • MOULDED CIRCUITS LIMITED [GB]/[GB] (AllExceptUS)
  • IMPEY, John [GB]/[GB] (UsOnly)
Inventors
  • IMPEY, John
Agents
  • JONES, Stephen, Anthony
Priority Data
9118599.130.08.1991GB
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MANUFACTURING METHOD FOR ELECTRICAL CIRCUIT BOARD
(FR) PROCEDE DE FABRICATION D'UNE PLAQUETTE DE CIRCUITS ELECTRIQUES
Abstract
(EN)
A method of producing an electrical circuit board comprises mounting electrically conducting circuit elements (31) moulded from plastics material on a pre-formed board (38). The circuit elements (31) are preferably made electrically conducting prior to mounting on the board (38) by plating with an electrical conductor. The method is of particular utility in the manufacture of three-dimensional circuit boards.
(FR)
Un procédé de fabrication d'une plaquette de circuits électriques consiste à monter des éléments (31) de circuit électroconducteur, moulés dans un matériau plastique, sur une plaquette préformée (38). On rend les éléments de circuit (31) électroconducteurs, de préférence avant qu'ils ne soient montés sur la plaquette (38), au moyen d'un plaquage par un matériau électroconducteur. Le procédé convient particulièrement à la fabrication de plaquettes de circuits en trois dimensions.
Also published as
Latest bibliographic data on file with the International Bureau