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1. WO1992016969 - SEMICONDUCTOR SEALING RESIN TABLET AND ITS MANUFACTURE

Publication Number WO/1992/016969
Publication Date 01.10.1992
International Application No. PCT/JP1992/000345
International Filing Date 19.03.1992
IPC
B29B 9/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
9Making granules
10by moulding the material, i.e. treating it in the molten state
B29B 11/14 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
11Making preforms
14characterised by structure or composition
B29B 13/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
13Conditioning or physical treatment of the material to be shaped
02by heating
B29C 35/16 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
35Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
16Cooling
B29C 43/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
B29C 43/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
02of articles of definite length, i.e. discrete articles
04using movable moulds
06continuously movable
08with circular movement
CPC
B29B 11/14
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
11Making preforms
14characterised by structure or composition
B29B 13/022
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
13Conditioning or physical treatment of the material to be shaped
02by heating
022Melting the material to be shaped
B29B 9/10
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
9Making granules
10by moulding the material, i.e. treating it in the molten state
B29C 2043/3689
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
32Component parts, details or accessories; Auxiliary operations
36Moulds for making articles of definite length, i.e. discrete articles
3676moulds mounted on rotating supporting constuctions
3689on a support table, flat disk-like tables having moulds on the periphery
B29C 35/16
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
35Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
16Cooling
B29C 43/00
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
Applicants
  • NITTO DENKO CORPORATION [JP]/[JP] (AllExceptUS)
  • TARUNO, Tomohiro [JP]/[JP] (UsOnly)
  • KANAI, Shinichi [JP]/[JP] (UsOnly)
  • ASAO, Hiroyuki [JP]/[JP] (UsOnly)
  • KIMURA, Syoichi [JP]/[JP] (UsOnly)
  • TOYODA, Yoshio [JP]/[JP] (UsOnly)
Inventors
  • TARUNO, Tomohiro
  • KANAI, Shinichi
  • ASAO, Hiroyuki
  • KIMURA, Syoichi
  • TOYODA, Yoshio
Agents
  • HAGINO, Taira
Priority Data
3/34964806.12.1991JP
3/8169620.03.1991JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR SEALING RESIN TABLET AND ITS MANUFACTURE
(FR) TABLETTE DE RESINE DE SCELLEMENT POUR SEMI-CONDUCTEUR ET SON PROCEDE DE FABRICATION
Abstract
(EN)
Tablets are made by cooling and solidifying a molten resin composition, having a compressibility C of 98 % or more and a metallic impurity content (including iron ions; the same applies hereinbelow) of less than 50 ppm. It is particularly preferable to keep 250-mesh or finer dust on the tablet surface at less than 0.05 wt % and the water content at less than 0.1 wt %.
(FR)
Des tablettes de résine sont fabriquées en refroidissant et en solidifiant une composition de résine fondue ayant une compressibilité C de 98 % ou plus, et une teneur en impuretés métalliques (y compris des ions fer; idem ci-dessous) inférieure à 50 ppm. Il est particulièrement préféré de maintenir la quantité de poussières de grosseur 250 ou plus fines à la surface de la tablette à une valeur inférieure à 0,05 % en poids et la teneur en eau inférieure à 0,1 % en poids.
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