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1. WO1992016597 - NON-AZEOTROPIC REFRIGERANT COMPOSITIONS COMPRISING DIFLUOROMETHANE; 1,1,1-TRIFLUOROETHANE; OR PROPANE

Publication Number WO/1992/016597
Publication Date 01.10.1992
International Application No. PCT/US1992/001160
International Filing Date 12.02.1992
Chapter 2 Demand Filed 12.08.1992
IPC
C09K 5/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
02Materials undergoing a change of physical state when used
04the change of state being from liquid to vapour or vice-versa
CPC
C09K 2205/106
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
2205Aspects relating to compounds used in compression type refrigeration systems
10Components
106Carbon dioxide
C09K 2205/12
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
2205Aspects relating to compounds used in compression type refrigeration systems
10Components
12Hydrocarbons
C09K 2205/134
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
2205Aspects relating to compounds used in compression type refrigeration systems
10Components
134containing sulfur
C09K 2205/22
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
2205Aspects relating to compounds used in compression type refrigeration systems
22All components of a mixture being fluoro compounds
C09K 2205/34
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
2205Aspects relating to compounds used in compression type refrigeration systems
34The mixture being non-azeotropic
C09K 5/045
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
02Materials undergoing a change of physical state when used
04the change of state being from liquid to vapour or vice versa
041for compression-type refrigeration systems
044comprising halogenated compounds
045containing only fluorine as halogen
Applicants
  • ALLIED-SIGNAL INC. [US]/[US]
Inventors
  • RICHARD, Robert, Gerard
  • SHANKLAND, Ian, R.
  • SINGH, Rajiv, Ratna
Agents
  • ROONEY, Gerard, P.
  • BROWN, Melanie, L.
Priority Data
671,27018.03.1991US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) NON-AZEOTROPIC REFRIGERANT COMPOSITIONS COMPRISING DIFLUOROMETHANE; 1,1,1-TRIFLUOROETHANE; OR PROPANE
(FR) COMPOSITIONS REFRIGERANTES NON AZEOTROPES COMPRENANT DU DIFLUOROMETHANE, DU 1,1,1-TRIFLUOROETHANE OU DU PROPANE
Abstract
(EN)
The present invention provides refrigerant blends which are replacements for chlorodifluoromethane (HCFC-22). The present blends have refrigeration characteristics which are similar to HCFC-22. The blends comprise from about 10 to about 90 weight percent of a first component selected from the group consisting of 1,1,1-trifluoroethane, difluoromethane, propane, and mixture thereof; from about 1 to about 50 weight percent of a second component selected from the group consisting of hydrofluorocarbon having 1 to 3 carbon atoms, fluorocarbon having 1 to 3 carbon atoms, inorganic compound, and mixtures thereof having a boiling point at atmospheric pressure in the range from about -90 degrees C to less than -50 degrees C; and from about 1 to about 50 weight percent of a third component which is hydrofluorocarbon having 1 to 3 carbon atoms, other than 1,1,1-trifluoroethane, having a boiling point at atmospheric pressure in the range from about -50 degrees C to about -10 degrees C. The refrigerant compositions have a vapor pressure substantially equal to the vapor pressure of HCFC-22.
(FR)
Mélanges réfrigérants destinés à remplacer le chlorodifluorométhane (HCFC-22) qui présentent des caractéristiques de réfrigération identiques à celles du HCFC-22. Lesdits mélanges comprennent environ 10 à environ 90 pourcent en poids d'un premier constituant sélectionné parmi le groupe formé du 1,1,1-trifluoroéthane, du difluorométhane, du propane et de mélange desdites substances; environ 1 à environ 50 pourcent en poids d'un second constituant sélectionné parmi le groupe formé de l'hydrofluorocarbone ayant 1 à 3 atomes de carbone, du fluorocarbone ayant de 1 à 3 atomes de carbone, d'un composé inorganique et de mélanges desdites substances ayant un point d'ébullition à la pression atmosphérique de l'ordre de -90 degrés C à moins de -50 degrés C; et 1 à environ 50 pourcent en poids d'un troisième constituant qui est de l'hydrofluorocarbone ayant 1 à 3 atomes de carbone, autre que le 1,1,1-trifluoroéthane, ayant un point d'ébullition à la pression atmosphérique de l'ordre de -50 degrés C à environ -10 degrés C. Lesdites compositions réfrigérantes ont une pression de vapeur pratiquement égale à la pression de vapeur du HCFC-22.
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