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1. (WO1992010365) NON-BEADING, THIN-FILM, METAL-COATED CERAMIC SUBSTRATE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1992/010365 International Application No.: PCT/US1991/008696
Publication Date: 25.06.1992 International Filing Date: 26.11.1991
Chapter 2 Demand Filed: 08.07.1992
IPC:
C03C 17/06 (2006.01) ,C04B 41/51 (2006.01) ,C04B 41/88 (2006.01) ,H01L 23/498 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/38 (2006.01)
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
17
Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating
06
with metals
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
41
After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
45
Coating or impregnating
50
with inorganic materials
51
Metallising
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
41
After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
80
of only ceramics
81
Coating or impregnating
85
with inorganic materials
88
Metals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
Applicants:
CORNELL RESEARCH FOUNDATION, INC. [US/US]; Suite 105 20 Thornwood Drive Ithaca, NY 14850, US
Inventors:
RAJ, Rishi; US
Agent:
SPECTOR, Eric, S. ; Jones, Tullar & Cooper P.O. Box 2266 Eads Station Arlington, VA 22202, US
Priority Data:
626,69613.12.1990US
Title (EN) NON-BEADING, THIN-FILM, METAL-COATED CERAMIC SUBSTRATE
(FR) SUBSTRAT EN CERAMIQUE A REVETEMENT METALLIQUE EN MINCE COUCHE, NE FORMANT PAS DE PERLES
Abstract:
(EN) A continuous thin film metal coated ceramic substrate is provided by employing intimate mixtures of transition element metal and element different from the transition element metal which is from the same group of the Periodic Table as the metallic or semimetallic atom of the ceramic of the substrate.
(FR) L'invention se rapporte à un substrat en céramique à revêtement métallique en mince couche continue, qu'on obtient en utilisant des mélanges intimes entre un métal élément de transition et un élément différent du métal élément de transition, qui appartient dans le tableau de classification périodique au même groupe que l'atome métallique ou semi-métallique du matériau céramique constituant le substrat.
Designated States: JP
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: English (EN)
Filing Language: English (EN)