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1. (WO1992009718) ANODE STRUCTURES FOR MAGNETRON SPUTTERING APPARATUS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1992/009718 International Application No.: PCT/US1991/008307
Publication Date: 11.06.1992 International Filing Date: 14.11.1991
Chapter 2 Demand Filed: 14.05.1992
IPC:
C23C 14/56 (2006.01) ,H01J 37/34 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
56
Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
34
operating with cathodic sputtering
Applicants:
VIRATEC THIN FILMS, INC. [US/US]; 2150 Airport Drive Faribault, MN 55021, US
Inventors:
DICKEY, Eric, R.; US
BJORNARD, Erik, J.; US
HOFMANN, James, J.; US
Agent:
EGAN, William, J., III ; Heller, Ehrman, White & McAuliffe 333 Bush Street San Francisco, CA 94104-2878, US
Priority Data:
616,67321.11.1990US
Title (EN) ANODE STRUCTURES FOR MAGNETRON SPUTTERING APPARATUS
(FR) STRUCTURES D'ANODES POUR APPAREIL DE PULVERISATION A MAGNETRONS
Abstract:
(EN) An in-line sputtering system with rotating cylindrical magnetrons (30) is fitted with a system of anodes (62) having a large surface area. The surface area is equal to or greater than the surface area of the sputtering chambers' internal walls (22, 24, 25 and 26). The anodes (62) may be grounded, allowed to float electrically, or connected to a separate bias power supply. The anode surfaces are protected from contamination by sputtered material or are designed so the electron collecting surface may be replaced during the sputtering process. The anodes (62) may be equipped with a magnet array for improving electron collecting efficiency.
(FR) L'invention se rapporte à un système de pulvérisation en ligne avec magnétrons cylindriques rotatifs (30), qui est équipé d'un système d'anodes (62) présentant une grande superficie, égale ou supérieure à la superficie des parois internes (22, 24, 25 et 26) des chambres de pulvérisation. Les anodes (62) peuvent être soit mises à la terre soit isolées électriquement de la terre soit encore connectées à une source de courant de polarisation séparée. Les surfaces des anodes sont soit protégées contre la contamination par le matériau pulvérisé soit conçues pour que la surface recueillant les électrons puissent être remplacée pendant le processus de pulvérisation. Les anodes (62) peuvent être pourvues d'un réseau d'aimants destiné à améliorer leur efficacité à receuillir les électrons.
Designated States: CA, JP
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0558604JPH06505768CA2096735