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Machine translation
1. (WO1992003904) MOUNTING OF ELECTRONIC DEVICES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1992/003904    International Application No.:    PCT/GB1991/001461
Publication Date: 05.03.1992 International Filing Date: 28.08.1991
IPC:
H01L 23/495 (2006.01), H01L 23/498 (2006.01), H01L 23/58 (2006.01)
Applicants: LSI LOGIC EUROPE PLC [GB/GB]; Grenville Place, The Ring, Bracknell, Berkshire RG12 1BP (GB) (For All Designated States Except US).
GAINEY, Trevor, Clifford [GB/GB]; (GB) (For US Only)
Inventors: GAINEY, Trevor, Clifford; (GB)
Agent: THOMSON, Roger, Bruce; W.P. Thompson & Co., Eastcheap House, Central Approach, Letchworth, Hertfordshire SG6 3DS (GB)
Priority Data:
9018763.4 28.08.1990 GB
Title (EN) MOUNTING OF ELECTRONIC DEVICES
(FR) MONTAGE DE DISPOSITIFS ELECTRONIQUES
Abstract: front page image
(EN)In contrast to the conventional automated bonding system, an electronic device (10) is mounted within a surrounding ring frame (12; 14) of insulating material by means of a plurality of individually applied tapes or ribbons (16) of electrically conductive material. A protective coating (18) may be applied to the assembly after bonding.
(FR)Contrairement au système traditionnel de soudage automatique, un dispositif électronique (10) est monté à l'intérieur d'un cadre annulaire (12; 14) en matériau isolant à l'aide d'une pluralité de bandes ou de rubans (16) de matériau électroconducteur appliqué(e)s séparément. Après le soudage, on peut appliquer une couche de protection (18) sur l'ensemble ainsi formé.
Designated States: GB, JP, US.
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE).
Publication Language: English (EN)
Filing Language: English (EN)