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Machine translation
1. (WO1992003847) ENCAPSULATION OF ELECTRONIC COMPONENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1992/003847    International Application No.:    PCT/GB1991/001460
Publication Date: 05.03.1992 International Filing Date: 28.08.1991
IPC:
H01L 23/057 (2006.01), H01L 23/31 (2006.01), H01L 23/433 (2006.01)
Applicants: LSI LOGIC EUROPE PLC [GB/GB]; Grenville Place, The Ring, Bracknell, Berkshire RG12 1BP (GB) (For All Designated States Except US).
GAINEY, Trevor, Clifford [GB/GB]; (GB) (For US Only)
Inventors: GAINEY, Trevor, Clifford; (GB)
Agent: THOMSON, Roger, Bruce; W.P. Thompson & Co, Eastcheap House, Central Approach, Letchworth, Hertfordshire SG6 3DS (GB)
Priority Data:
9018762.6 28.08.1990 GB
Title (EN) ENCAPSULATION OF ELECTRONIC COMPONENTS
(FR) ENCAPSULATION DE COMPOSANTS ELECTRONIQUES
Abstract: front page image
(EN)For physical protection and to reduce stress, an electronic device (10) is mounted within a cavity in a housing (14) which constitutes an encapsulating member. The housing is preferably formed as two premoulded piece parts (14a, 14b). A leadframe (12) extends into the housing (14) in the manner of a sandwich constructon. The device (10) may be mounted on a heat sink (16).
(FR)Pour assurer sa protection physique et pour réduire les sollicitations, on monte un dispositif électronique (10) à l'intérieur d'une cavité dans un boîtier (14) constituant un élément d'encapsulation. De préférence, le boîtier est constitué de deux parties préformées (14a, 14b). Un cadre de montage (12) s'étend jusque dans le boîtier (14) à la manière d'une structure sandwich. Le dispositif peut être monté sur un puits de chaleur (16).
Designated States: GB, JP, US.
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE).
Publication Language: English (EN)
Filing Language: English (EN)