WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO1992001011) NOVEL PHENOL/ARALKYL RESIN, PRODUCTION THEREOF, AND EPOXY RESIN COMPOSITION CONTAINING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1992/001011    International Application No.:    PCT/JP1991/000908
Publication Date: 23.01.1992 International Filing Date: 08.07.1991
IPC:
C08G 61/02 (2006.01), C08L 63/00 (2006.01), H01L 23/29 (2006.01)
Applicants: MITSUI TOATSU CHEMICALS, INC. [JP/JP]; 2-5, Kasumigaseki 3-chome, Chiyoda-ku, Tokyo 100 (JP) (For All Designated States Except US).
URAKAMI, Tatsuhiro [JP/JP]; (JP) (For US Only).
YAMAGUCHI, Keizaburo [JP/JP]; (JP) (For US Only).
MACHIDA, Koichi [JP/JP]; (JP) (For US Only).
KITAHARA, Mikio [JP/JP]; (JP) (For US Only).
KUBO, Takayuki [JP/JP]; (JP) (For US Only).
TORIKAI, Motoyuki [JP/JP]; (JP) (For US Only).
ASAHINA, Koutaro [JP/JP]; (JP) (For US Only).
TANAKA, Junsuke [JP/JP]; (JP) (For US Only).
YAMAGUCHI, Akihiro [JP/JP]; (JP) (For US Only).
IKADO, Shuhei [JP/JP]; (JP) (For US Only)
Inventors: URAKAMI, Tatsuhiro; (JP).
YAMAGUCHI, Keizaburo; (JP).
MACHIDA, Koichi; (JP).
KITAHARA, Mikio; (JP).
KUBO, Takayuki; (JP).
TORIKAI, Motoyuki; (JP).
ASAHINA, Koutaro; (JP).
TANAKA, Junsuke; (JP).
YAMAGUCHI, Akihiro; (JP).
IKADO, Shuhei; (JP)
Agent: MOGAMI, Shotaro; Nagatani City Plaza 201, 8-1, Akasaka 1-chome, Minato-ku, Tokyo 107 (JP)
Priority Data:
2/180675 10.07.1990 JP
2/187883 18.07.1990 JP
2/211546 13.08.1990 JP
2/215838 17.08.1990 JP
2/237182 10.09.1990 JP
2/237183 10.09.1990 JP
Title (EN) NOVEL PHENOL/ARALKYL RESIN, PRODUCTION THEREOF, AND EPOXY RESIN COMPOSITION CONTAINING THE SAME
(FR) NOUVELLE RESINE DE PHENOL/ARALKYLE, SON PROCEDE DE PREPARATION, ET COMPOSITION DE RESINE EPOXY RENFERMANT CETTE NOUVELLE RESINE
Abstract: front page image
(EN)A low-molecular phenol/aralkyl resin with a softening point of 100 °C or below, represented by general formula (I), wherein X represents a divalent group of formula (II) or (III), and n represents an integer of 0 to 10; a process for producing the resin; and an epoxy resin composition containing the resin as a curing agent.
(FR)Résine de phénol/aralkyle à faible masse molaire, dont la température de déformation est égale ou inférieure à 100 °C, et qui est représentée par la formule générale (I) dans laquelle X représente un groupe bivalent de formule (II) ou (III), et n représente un entier compris entre 0 et 10; l'invention concerne un procédé de préparation de cette résine; et une composition de résine époxy renfermant ladite résine en tant qu'agent de polymérisation.
Designated States: KR, US.
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)