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1. WO1992000404 - PROCESS FOR PREPARING NONCONDUCTIVE SUBSTRATES

Publication Number WO/1992/000404
Publication Date 09.01.1992
International Application No. PCT/US1990/006733
International Filing Date 16.11.1990
Chapter 2 Demand Filed 12.12.1991
IPC
C25D 5/54 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54Electroplating of non-metallic surfaces
H05K 3/38 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
H05K 3/42 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes
CPC
C25D 5/54
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54Electroplating of non-metallic surfaces
H05K 2201/0323
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
032Materials
0323Carbon
H05K 2203/122
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
12Using specific substances
122Organic non-polymeric compounds, e.g. oil, wax, thiol
H05K 3/383
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
382by special treatment of the metal
383by microetching
H05K 3/424
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
423characterised by electroplating method
424by direct electroplating
H05K 3/427
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
425characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
427initial plating of through-holes in metal-clad substrates
Applicants
  • OLIN CORPORATION [US]/[US]
Inventors
  • PIANO, Anthony, M.
  • GALVEZ, Randolfo
Agents
  • PAPUGA, D., M.
  • SIMONS, W., A.
Priority Data
545,22428.06.1990US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) PROCESS FOR PREPARING NONCONDUCTIVE SUBSTRATES
(FR) PROCEDE SERVANT A PREPARER DES SUBSTRATS NON CONDUCTEURS
Abstract
(EN) Described herein is a process for treating the tooling holes or slots which have been coated with a carbon black dispersion in a nonconductive material which comprises removing said carbon black with an aqueous solution containing: (a) an alkanolamine; (b) an anionic surfactant which is the neutralized addition product of maleic and/or fumaric acid and a poly(oxylated) alcohol; (c) a nonionic surfactant which is an aliphatic mono and/or diphosphate ester; and (d) an alkali or alkaline earth metal hydroxide.
(FR) On décrit un procédé pour traiter les fentes ou les trous de perçage de cartes de circuits imprimés, qui ont été revêtus d'une dispersion de noir de carbone dans un matériau non conducteur. Ce procédé comporte l'élimination dudit noir de carbone avec une solution aqueuse contenant: (a) une alcanolamine; (b) un tensio-actif anionique, qui est le produit d'addition neutralisé de l'acide maléique, et/ou de l'acide fumarique et un alcool poly(oxylé); (c) un tension-actif non ionique qui est un ester de monophosphate et/ou de diphosphate aliphatique; et (d) un hydroxyde d'un métal alcalin ou alcalino-terreux.
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