Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1991018415) CIRCUIT BOARD FOR MOUNTING IC AND MOUNTING METHOD THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/018415 International Application No.: PCT/JP1991/000680
Publication Date: 28.11.1991 International Filing Date: 22.05.1991
IPC:
H01L 21/60 (2006.01) ,H01L 23/498 (2006.01) ,H05K 1/18 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
NIPPON MEKTRON, LTD. [JP/JP]; 12-15, Shibadaimon 1-chome Minato-ku Tokyo 105, JP (DE)
TANAKA, Yasuyuki [JP/JP]; JP (UsOnly)
OOMACHI, Chikafumi [JP/JP]; JP (UsOnly)
Inventors:
TANAKA, Yasuyuki; JP
OOMACHI, Chikafumi; JP
Agent:
KAMATA, Shuko; 112-1, Taku-cho Ushiku-shi Ibaraki 300-12, JP
Priority Data:
2/13478324.05.1990JP
Title (EN) CIRCUIT BOARD FOR MOUNTING IC AND MOUNTING METHOD THEREOF
(FR) PLAQUETTE DE MONTAGE DE CIRCUITS INTEGRES ET SON PROCEDE DE MONTAGE
Abstract:
(EN) A circuit board for mounting ICs comprises required circuit conductor patterns formed on one side of an insulation layer, bumps for bonding the pads of ICs to them which are connected to required parts of the circuit conductor patterns electrically, penetrate the insulation layer and protruding to the external of the circuit board, and a light transmitting insulation coating layer which can transmit irradiation light for heating and melting the bumps and is formed on the circuit conductor pattern side. There is a basic method of mounting ICs on such a circuit board in which pads of an IC chip are connected electrically with the bumps after heating and melting the bumps by the action of the irradiation light projected concentratedly on the bump parts from the side of the light transmitting insulation coating layer in the state that the IC chip are placed on the bumps.
(FR) Une plaquette permettant le montage de circuits intégrés comprend des configurations de conducteur de circuits requises formées sur un côté d'une couche isolante, des bossages de contact de puce permettant de leur souder les plots des circuits intégrés, lesquels sont électriquement connectés à des parties requises des configurations de conducteur de circuits, pénètrent dans la couche d'isolation et se prolongent à l'extérieur de la carte, ainsi qu'une couche de revêtement isolante transparente, laquelle peut transmettre une lumière rayonnante afin de chauffer et de porter à fusion les bossages de contact de puce, et est formée du côté des configurations de conducteur de circuits. Il existe un procédé de base de montage de circuits intégrés sur une telle plaquette, dans lequel les plots d'une puce à circuit intégré sont électriquement connectés aux bossages de contact de puce après que l'on ait chauffé et porté à fusion ces derniers sous l'effet de la lumière rayonnante projetée de manière concentrée sur les parties de bossages de contact de puce, à partir du côté de la couche de revêtement isolante transparente dans l'état dans lequel la puce à circuits intégrés est placée sur les bossages de contact de puce.
Designated States: DE, US
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US5250469