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1. (WO1991018126) SPUTTER TARGET DESIGN
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/018126 International Application No.: PCT/US1991/002077
Publication Date: 28.11.1991 International Filing Date: 27.03.1991
Chapter 2 Demand Filed: 16.10.1991
IPC:
C23C 14/34 (2006.01) ,H01J 37/34 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
34
operating with cathodic sputtering
Applicants:
TOSOH SMD, INC. [US/US]; 3515 Grove City Road Grove City, OH 43123-3099, US
Inventors:
QAMAR, Sohail, Syed; US
CONARD, Harry, Wayne; US
HAMILTON, Lowell, E.; US
Agent:
PEACOCK, Bruce, E. ; Biebel & French 2500 Kettering Tower Dayton, OH 45423, US
Priority Data:
525,36117.05.1990US
Title (EN) SPUTTER TARGET DESIGN
(FR) SYSTEME DE CIBLE POUR ENSEMBLE DE PULVERISATION CATHODIQUE
Abstract:
(EN) A cathode sputtering assembly includes a sputter target (10) welded to a corresponding backing member (40), where the target (10) and backing member (40) are adapted for insertion into a sputtering system. The target (10) has a reduced diameter portion profiled for receipt within a counterbored upper section of the backing member (40). The target (10) has a beveled surface (14) above the reduced diameter section, and the baking member (40) has an upper tapered edge (44), where the interface between the sputtering target and the backing member cooperate to define a V-groove. Both the target (10) and the backing member (40) are comprised of aluminum and the target (10) backing member (40) are TIG welded together with aluminum filler rod.
(FR) Un ensemble de pulvérisation cathodique comprend une cible (10) soudée à un élément correspondant de renforcement situé à l'arrière (40), la cible (10) et l'élément de renforcement (40) étant conçus pour être introduits dans un sytème de pulvérisation cathodique. La cible (10) comporte une partie à diamètre réduit profilée pour venir se loger dans une partie supérieure à épaulement de l'élément de renforcement (40). La cible (10) possède une surface à pan coupé (14) située au-dessus de la partie à diamètre réduit, et l'élément de renforcement (40) possède un bord supérieur diminué (44) où la jonction entre la cible et l'élément de renforcement définissent ensemble une rainure en forme de V. La cible (10) et l'élément de renforcement (40) sont tous deux composés d'aluminium, et la cible (10) et l'élément de renforcement (40) sont soudés ensemble par procédé TIG avec une baguette d'apport en aluminium.
Designated States: JP, KR
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: English (EN)
Filing Language: English (EN)