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1. (WO1991017897) SEMICONDUCTOR PROCESSOR APPARATUS WITH DYNAMIC WAFER VAPOR TREATMENT AND PARTICLE VOLATILIZATION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/017897 International Application No.: PCT/US1991/002956
Publication Date: 28.11.1991 International Filing Date: 19.04.1991
Chapter 2 Demand Filed: 03.12.1991
IPC:
G11B 7/26 (2006.01) ,H01L 21/00 (2006.01) ,H01L 21/687 (2006.01)
G PHYSICS
11
INFORMATION STORAGE
B
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor
24
Record carriers characterised by shape, structure or physical properties, or by the selection of the material 
26
Apparatus or processes specially adapted for the manufacture of record carriers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
Applicants:
SEMITOOL, INC. [US/US]; 655 West Reserve Drive Kalispell, MT 59901, US
Inventors:
BERGMAN, Eric, J.; US
REARDON, Timothy, J.; US
THOMPSON, Raymon, F.; US
OWCZARZ, Aleksander; US
Agent:
GREGORY, Randy, A. ; West 601 Main Avenue Suite 815 Spokane, WA 99201-0679, US
Priority Data:
524,23915.05.1990US
526,05221.05.1990US
526,05721.05.1990US
526,24318.05.1990US
665,60906.03.1991US
665,94206.03.1991US
Title (EN) SEMICONDUCTOR PROCESSOR APPARATUS WITH DYNAMIC WAFER VAPOR TREATMENT AND PARTICLE VOLATILIZATION
(FR) APPAREIL DE TRAITEMENT DYNAMIQUE DE TRANCHES DE SEMICONDUCTEURS EN PHASE VAPEUR ET PAR VOLATILISATION DE PARTICULES
Abstract:
(EN) Disclosed are apparatuses and methods for improved processing of semiconductor wafers (20) and the like using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants (40) are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl (14). Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions. The apparatuses provide efficient uniform etching with low particle count performance.
(FR) Appareils et procédés de traitement amélioré de tranches de semiconducteur (20) et analogue utilisant des agents chimiques de traitement en phase vapeur, notamment des agents de gravure d'acide hydrofluorique aqueux. On produit des mélanges en phase vapeur homogènes à partir de mélanges liquides homogènes. Des moyens de recyclage, de mélange et d'agitation des réactifs de phase liquide (40) sont décrits. Dans certains modes de réalisation il est avantageux de faire circuler la phase liquide dans une tranchée chimique à l'intérieur de la cuvette de traitement (14). On peut réguler l'exposition des tranches à des vapeurs provenant de la tranchée chimique à l'aide d'une vanne de régulation de vapeur avantageusement constituée par la partie inférieure de la chambre de traitement. La tranche est mise en rotation ou autrement déplacée à l'intérieur de la chambre de traitement afin d'assurer une dispersion uniforme des vapeurs de réactifs homogènes sur la surface de la tranche, et afin de faciliter la circulation de vapeurs sur la surface traitée. On peut utiliser un dispositif de traitement par volatilisation radiative afin de volatiliser les produits dérivés de la réaction se fromant dans certaines conditions. Les appareils assurent une gravure uniforme et efficace ne produisant que peu de particules.
Designated States: AT, AU, BB, BG, BR, CA, CH, DE, DK, ES, FI, GB, HU, JP, KP, KR, LK, LU, MC, MG, MW, NL, NO, PL, RO, SD, SE, SU
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CM, GA, ML, MR, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0528995JPH05507389AU1991079613