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1. (WO1991017880) RESIN FILM AND METHOD OF MAKING SAID FILM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/017880 International Application No.: PCT/JP1991/000673
Publication Date: 28.11.1991 International Filing Date: 20.05.1991
IPC:
B29C 55/12 (2006.01) ,B32B 37/14 (2006.01) ,C08G 73/10 (2006.01) ,C08J 5/18 (2006.01) ,H05K 1/03 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
55
Shaping by stretching, e.g. drawing through a die; Apparatus therefor
02
of plates or sheets
10
multiaxial
12
biaxial
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
14
characterised by the properties of the layers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA [JP/JP]; 2-4, Nakanoshima 3-chome Kita-ku Osaka-shi Osaka 530, JP (AllExceptUS)
OKADA, Koji [JP/JP]; JP (UsOnly)
OHNARI, Yoshihide [JP/JP]; JP (UsOnly)
MIZUGUCHI, Toshinori [JP/JP]; JP (UsOnly)
HAZAMA, Junichi [JP/JP]; JP (UsOnly)
Inventors:
OKADA, Koji; JP
OHNARI, Yoshihide; JP
MIZUGUCHI, Toshinori; JP
HAZAMA, Junichi; JP
Agent:
KUSUMOTO, Takayoshi; 6 Floor Toa Bldg. 3-18, Oogaya 1-chome Otsu-shi Shiga 520-21, JP
Priority Data:
2/13206821.05.1990JP
Title (EN) RESIN FILM AND METHOD OF MAKING SAID FILM
(FR) FILM RESINEUX ET PROCEDE DE FABRICATION ASSOCIE
Abstract:
(EN) A resin film for mainly making a flexible printed circuit board and a method of making the film. When a copper foil (2) is etched in a specified pattern after heat-bonded to a resin film (1) in order to make a flexible printed circuit board, said board undergoes a dimensional variation. For the purpose of reducing such dimensional variation, a ratio (a/b) of a linear expansion coefficient (a) of the resin film (1) in the mechanical feeding direction (MD direction) to that (b) in the direction (TD direction) perpendicular to said mechanical feeding one is set at 0.2 or more but less than 1.0, and the linear expansion coefficient in said mechanical feeding direction (MD direction) is set at 0.4 to 2.0 x 10-5 °C-1. As a resin film, a polyimide film including 90 % or more of identity period represented by a specified general formula is used. Further, for making said resin film, the film (1) is stretched 1.0 to 1.5 times in the mechanical feeding direction (MD direction) and 0.5 to 0.99 times in the direction (TD direction) perpendicular to the mechanical direction.
(FR) L'invention se rapporte à un film résineux utilisé essentiellement dans la fabrication de cartes de circuits imprimés flexibles, ainsi qu'à un procédé de fabrication d'un tel film. Lors de la fabrication de cartes de circuits imprimés flexibles, la carte subit une variation de dimensions au moment où on procède à l'attaque d'une feuille de cuivre (2) selon un motif spécifié après thermocollage de la feuille sur un film résineux (1). Pour réduire cette variation des dimensions, un rapport (a/b) entre le coefficient d'expansion linéaire (a) du film résineux (1) dans la direction d'avance mécanique (direction MD) et le coefficient d'expansion linéaire (b) de ce même film dans la direction (direction TD) perpendiculaire à la direction d'avance mécanique est réglé sur une valeur égale à 0,2 ou davantage mais inférieure à 1,0, et le coefficient d'expansion linéaire dans la direction d'avance mécanique (direction MD) est reglé sur une valeur comprise entre 0,4 et 2,0 x 10-5 °C-1. On utilise comme film résineux un film de polyimide représenté par une formule générale spécifiée et contenant un pourcentage de période d'identité égale à 90 ou plus. En outre, pour produire un tel film résineux, on fait subir au film (1) un allongement de 1,0 à 1,5 fois dans la direction d'avance mécanique (direction MD) et de 0,5 à 0,99 fois dans la direction (direction TD) perpendiculaire à la direction d'avance mécanique.
Designated States: US
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP0483376US5300619