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1. (WO1991017567) HEAT SINK ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/017567 International Application No.: PCT/US1991/002636
Publication Date: 14.11.1991 International Filing Date: 17.04.1991
IPC:
H01L 23/40 (2006.01) ,H01L 23/552 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
552
Protection against radiation, e.g. light
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
MOTOROLA, INC. [US/US]; 1303 East Algonquin Road Schaumburg, IL 60196, US
Inventors:
GALICH, Michael, G.; US
JOHNSON, Dale, G.; US
Agent:
PARMELEE, Steven, G. ; Motorola, Inc. Intellectual Property Dept. 1303 East Algonquin Road Schaumburg,IL 60196, US
Priority Data:
516,84330.04.1990US
Title (EN) HEAT SINK ASSEMBLY
(FR) ENSEMBLE DISSIPATEUR DE CHALEUR
Abstract:
(EN) A heat sink/electromagnetic shield assembly for a circuit element (22) disposed upon a circuit board (20). A spring clip (24) containing at least one hooked projection (32) forming the spring is positioned in a confronting relationship with the circuit element (22). A U-shaped housing (26) is slidingly positioned over the circuit element (22) and the spring clip (24) to enclose the circuit element (22) and to compress the hooked projection (32) which forms the spring. Compression of the hooked projection (32) causes the hooked projection (32) to exert a spring force to retain the housing (26) in position about the circuit element (22). The assembly may be constructed in line during construction of the electrical circuit (22) disposed upon the circuit board (20).
(FR) Un ensemble dissipateur de chaleur/écran électromagnétique pour un élément de circuit (22) placé sur une plaquette de circuits (20). Une pince à ressort (24) comportant au moins un crochet en saillie (32) formant le ressort est placée de manière que l'élément de circuit (22) puisse s'engager dans ladite pince. Un logement en U (26) est positionné par coulissement au-dessus de l'élément de circuit (22) et de la pince à ressort (24) pour enfermer l'élément de circuit (22) et comprimer le crochet en saillie (32) qui forme le ressort. Une fois comprimé, le crochet en saillie (32) exerce une force élastique qui retient le logement (26) en position autour de l'élément de circuit (22). L'ensemble peut être monté en ligne au cours du montage du circuit électrique (22) placé sur la plaquette de circuits (20).
Designated States: BR, CA
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
CA2062803