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1. (WO1991008899) BUBBLE JET PRINT HEAD HAVING IMPROVED MULTIPLEX ACTUATION CONSTRUCTION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/008899 International Application No.: PCT/US1990/007141
Publication Date: 27.06.1991 International Filing Date: 06.12.1990
IPC:
B41J 2/14 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
J
TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2
Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005
characterised by bringing liquid or particles selectively into contact with a printing material
01
Ink jet
135
Nozzles
14
Structure thereof
Applicants:
EASTMAN KODAK COMPANY [US/US]; 343 State Street Rochester, NY 14650, US
Inventors:
BRAUN, Hilarion; US
Agent:
HUSSER, John, D.; 343 State Street Rochester, NY 14650-2201, US
Priority Data:
451,70918.12.1989US
Title (EN) BUBBLE JET PRINT HEAD HAVING IMPROVED MULTIPLEX ACTUATION CONSTRUCTION
(FR) TETE D'IMPRESSION A JET DE BULLES A STRUCTURE D'ACTIONNEMENT MULTIPLEX AMELIOREE
Abstract:
(EN) The construction includes a support substrate (51); a first circuit portion having branches (31a-31l) that include a resistive heater element (32) and a diode device (33) formed in spaced relation on the substrate (51). A dielectric passivation layer (52) overlies the first circuit portion except at the discrete terminal regions of the first circuit portion branches (31a-31l). A second circuit portion comprising a plurality of multiplex electrode lines (37, 38, 39) overlies the passivation layer (52) and includes connection sections extending through the passivation layer into contact with terminal regions of the first circuit. A second passivation layer (60) overlies the second circuit portion, but not the resistive heater elements.
(FR) La structure comprend un substrat de support (51); une première partie de circuit dotée de ramifications (31a-31l) comprenant un élément chauffant résistif (32) ainsi qu'un dispositif à diodes (33) formé de manière espacée sur le substrat (51). Une couche de passivation diélectrique (52) recouvre la première partie de circuit, excepté au niveau des régions terminales discrètes des ramifications (31a-31l) de la première partie de circuit. Une seconde partie de circuit comprenant une pluralité de lignes d'électrodes multiplex (37, 38, 39), recouvre la couche de passivation (52) et comporte des parties de connexion s'étendant dans la couche de passivation, et en contact avec des régions terminales du premier circuit. Une seconde couche de passivation (60) recouvre la seconde partie de circuit, mais pas les éléments chauffants résistifs.
Designated States: JP
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0458958