Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1991008325) PROCESS FOR DIRECT GALVANIC METALLISATION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/008325 International Application No.: PCT/DE1990/000946
Publication Date: 13.06.1991 International Filing Date: 04.12.1990
Chapter 2 Demand Filed: 03.06.1991
IPC:
C23C 18/28 (2006.01) ,C25D 5/54 (2006.01) ,C25D 5/56 (2006.01) ,H05K 3/42 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
20
of organic surfaces, e.g. resins
28
Sensitising or activating
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54
Electroplating of non-metallic surfaces
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54
Electroplating of non-metallic surfaces
56
of plastics
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
42
Plated through-holes
Applicants:
SCHERING AKTIENGESELLSCHAFT [DE/DE]; Müllerstr. 170/178 Postfach 650311 D-13342 Berlin, DE (AllExceptUS)
MIDDEKE, Hermann-Josef [DE/DE]; DE (UsOnly)
MAJENTNY, Klaus [DE/DE]; DE (UsOnly)
Inventors:
MIDDEKE, Hermann-Josef; DE
MAJENTNY, Klaus; DE
Priority Data:
P 39 40 407.204.12.1989DE
Title (DE) VERFAHREN ZUR GALVANISCHEN DIREKTMETALLISIERUNG
(EN) PROCESS FOR DIRECT GALVANIC METALLISATION
(FR) PROCEDE DE METALLISATION DIRECTE ELECTROLYTIQUE
Abstract:
(DE) Die Erfindung betrifft ein Verfahren zur galvanischen Abscheidung auf der Oberfläche von Nichtleitern ohne die vorherige Belebung mit Metall aus chemisch reduktiv abscheidenden Bädern zum Zwecke der Herstellung von Metallschichten oder von durchkontaktierten Leiterplatten, gekennzeichnet durch die folgenden Verfahrensschritte: Vorreinigen, gegebenenfalls Anätzen oder Anquellen der zu metallisierenden Oberfläche, Belegen der Oberfläche mit einem Adhäsionsmittel, Adsorption einer Metallverbindung, Reduktion der Metallverbindung zum Metall, Galvanische Metallisierung.
(EN) The invention relates to a process for galvanic deposition on the surface of non-conductors without previously coating them with metal from chemically reductive baths for the purposes of making metal coatings or through hole-plated printed circuit boards in which the following steps are taken: pre-cleaning, possibly etching or wetting the surface to be metallised; coating the surface with an adhesion agent; adsorption of a metal compound; reduction of the metal compound to metal; galvanic metallisation.
(FR) L'invention concerne un procédé de dépôt électrolytique sur les surfaces de non-conducteurs, sans revêtement préalable par un métal provenant de bains de dépôt chimiquement réducteurs, dans le but de produire des couches métalliques ou des cartes de circuits imprimés à trous métallisés, caractérisé en ce qu'il comporte les étapes suivantes: nettoyage préalable, éventuellement décapage ou trempage de la surface à métalliser; revêtement de la surface par un agent d'adhérence; adsorption d'un composé métallique; réduction du composé métallique en métal; métallisation électrolytique.
Designated States: CA, JP, KR, US
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: German (DE)
Filing Language: German (DE)