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1. (WO1991007776) A METHOD FOR HOUSING A TAPE-BONDED ELECTRONIC DEVICE AND THE PACKAGE EMPLOYED
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/007776 International Application No.: PCT/US1990/006474
Publication Date: 30.05.1991 International Filing Date: 05.11.1990
Chapter 2 Demand Filed: 15.05.1991
IPC:
H01L 21/50 (2006.01) ,H01L 23/10 (2006.01) ,H01L 23/367 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
10
characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
Applicants:
OLIN CORPORATION [US/US]; 350 Knotter Drive P.O. Box 586 Cheshire, CT 06410-0586, US
Inventors:
BRADEN, Jeffrey, S.; US
Agent:
ROSENBLATT, Gregory, S. ; Olin Corporation 350 Knotter Drive P.O. Box 586 Cheshire, CT 06410-0586, US
Priority Data:
436,85415.11.1989US
Title (EN) A METHOD FOR HOUSING A TAPE-BONDED ELECTRONIC DEVICE AND THE PACKAGE EMPLOYED
(FR) METHODE PERMETTANT DE LOGER UN DISPOSITIF ELECTRONIQUE COLLE PAR BANDE ADHESIVE ET BOITIER EMPLOYE
Abstract:
(EN) A method for the assembly of an adhesively sealed tape package (50) having base (36) and cover (38) components is provided. An electronic device (32) is first bonded to the inner leads (28) of a tape leadframe (12). The chip on tape (10) is then disposed between the base component (36) and the cover (38) component and adhesively sealed (42, 43) to both. The electronic device (32) and a portion of the inner leads (28) are thereby encapsulated. In one embodiment the base (36) and cover (38) components are an aluminum base alloy having an anodization layer (44) over at least those surfaces exposed to the external environment or the adhesive (42, 43).
(FR) On décrit une méthode permettant d'assembler un emballage (50) en bande scellé par adhésion possédant une base (36) et un couvercle (38). Un dispositif électronique (32) est tout d'abord soudé aux conducteurs internes (28) d'un réseau conducteur en bande (12). La puce fixée sur la bande (10) est alors placée entre la base (36) et le couvercle (38) et collée (42, 43) à ceux-ci. Le dispositif électronique (32) et une partie des conducteurs internes (28) sont ainsi encapsulés. Selon une réalisation la base (36) et le couvercle (38) sont en alliage à base d'aluminium possédant une couche d'anodisation (44) sur au moins les surfaces exposées à l'environnement externe ou à l'adhésif (42, 43).
Designated States: AU, BB, BG, BR, CA, FI, HU, JP, KR, LK, MC, MG, MW, NO, RO, SD, SU
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CM, GA, ML, MR, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0500750CA2066704AU1991068724