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1. (WO1991007358) SILVER PHOSPHATE GLASS DIE-ATTACH COMPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/007358 International Application No.: PCT/US1990/006520
Publication Date: 30.05.1991 International Filing Date: 08.11.1990
Chapter 2 Demand Filed: 28.05.1991
IPC:
C03C 3/16 (2006.01) ,C03C 8/18 (2006.01) ,C03C 8/24 (2006.01) ,H01L 21/58 (2006.01)
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
3
Glass compositions
12
Silica-free oxide glass compositions
16
containing phosphorus
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
8
Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
14
Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions
18
containing free metals
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
C
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
8
Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
24
Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
58
Mounting semiconductor devices on supports
Applicants:
VLSI PACKAGING MATERIALS, INC. [US/US]; 1306 Bordeaux Drive Sunnyvale, CA 94089, US
Inventors:
DUMISNIL, Maurice, E.; US
FINKELSTEIN, Leo; US
Agent:
CIOTTI, Thomas, E.; Irell & Manella 545 Middlefield Road Suite 200 Menlo Park, CA 94025, US
Priority Data:
433,53908.11.1989US
Title (EN) SILVER PHOSPHATE GLASS DIE-ATTACH COMPOSITION
(FR) COMPOSE DE VERRE A PHOSPHATE D'ARGENT POUR FIXATION DE SEMICONDUCTEURS
Abstract:
(EN) Extremely low-melting oxide glasses useful in silver/glass die-attach materials are disclosed. These glasses are composed of silver oxide, phosphorus oxide and a third component comprising PbO, CdO, ZnO or combination thereof. Their melting point lies in the 200-300 °C range.
(FR) L'on décrit des verres à teneur en oxyde ayant un point de fusion extrêmement bas utilisables dans des matériaux argent/verre pour la fixation des semiconducteurs. Ces verres sont composés d'oxyde d'argent, d'oxyde de phosphore et d'un troisième composant comprenant du PbO, du ZnO ou un combinaison de ceux-ci. Leur point de fusion se situe dans une fourchette de 200 à 300 °C.
Designated States: CA, JP, KR
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: English (EN)
Filing Language: English (EN)