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1. (WO1991007236) METHOD AND APPARATUS FOR THE RAPID DEPOSITION BY CHEMICAL VAPOR DEPOSITION WITH LOW VAPOR PRESSURE REACTANTS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/007236 International Application No.: PCT/US1990/006792
Publication Date: 30.05.1991 International Filing Date: 20.11.1990
IPC:
B05D 7/24 (2006.01) ,C23C 16/40 (2006.01) ,C23C 16/448 (2006.01) ,H01L 39/24 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
7
Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
24
for applying particular liquids or other fluent materials
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
22
characterised by the deposition of inorganic material, other than metallic material
30
Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
40
Oxides
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
448
characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39
Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
24
Processes or apparatus specially adapted for the manufacture or treatment of devices provided for in group H01L39/135
Applicants:
GEORGIA TECH RESEARCH CORPORATION [US/US]; 400 10th Avenue, N.W. Atlanta, GA 30332-0420, US
Inventors:
LACKEY, Walter, Jackson; US
CARTE, William, Brent; US
HANIGOFSKY, John, A.; US
HILL, David, N.; US
BAREFIELD, E., Kent; US
Agent:
DEVEAU, Todd; Hurt, Richardson, Garner, Todd & Cadenhead 999 Peachtree Street, N.E. Suite 1400 Atlanta, GA 30309-3999, US
Priority Data:
439,84321.11.1989US
Title (EN) METHOD AND APPARATUS FOR THE RAPID DEPOSITION BY CHEMICAL VAPOR DEPOSITION WITH LOW VAPOR PRESSURE REACTANTS
(FR) PROCEDE ET APPAREIL DE DEPOSITION RAPIDE EN PHASE VAPEUR PAR PROCEDE CHIMIQUE AVEC DES REACTIFS SOUS UNE BASSE PRESSION DE VAPEUR
Abstract:
(EN) An apparatus for the coating of substrates using chemical vapor deposition in which low vapor pressure reactants are used comprising a powder feeder means (12) or atomizer feeder means (112) which is used to introduce the reactants into a chemical vapor deposition furnace (50); the entire apparatus being useful for coating substrate using chemical vapor deposition in which low vapor pressure reactants are used, comprising the steps of providing a substrate (52) and a quantity of one or more reagents, placing the substrate within the furnace, introducing the reactants into and reacting the reactants within the furnace resulting in the deposition of a coating consisting essentially of the reactant components on the substrate; said reagents generally chosen to yield the group of oxide superconductors.
(FR) Un appareil d'enduction de substrats par déposition en phase vapeur par procédé chimique qui utilise des réactifs sous une basse pression de vapeur comprend une alimentation en poudre (12) ou un atomiseur d'alimentation (112) qui introduit les réactifs dans un four (50) de déposition en phase vapeur par procéde chimique. L'appareil dans son ensemble est utile pour enduire des substrats par dépositon en phase vapeur par procédé chimique avec des réactifs sous une basse pression de vapeur. A cet effet, on utilise un substrat (52) et une certaine quantité d'un ou de plusieurs réactifs, on place le substrat dans le four, on introduit les réactifs dans le four et on provoque leur réaction dans celui-ci, ce qui entraîne la déposition d'un enduit sur le substrat formé essentiellement des composants réactifs. Ces réactifs sont généralement choisis afin de produire le groupe des oxydes supraconducteurs.
Designated States: AU, CA, JP
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0454843US5352656AU1991070620