Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1991006977) FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC AND METHOD OF PRODUCING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/006977 International Application No.: PCT/JP1990/001413
Publication Date: 16.05.1991 International Filing Date: 02.11.1990
IPC:
H01L 21/48 (2006.01) ,H01L 21/607 (2006.01) ,H01L 23/495 (2006.01) ,H01L 23/498 (2006.01) ,H05K 1/00 (2006.01) ,H05K 1/11 (2006.01) ,H05K 3/42 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48
Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
607
involving the application of mechanical vibrations, e.g. ultrasonic vibrations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
495
Lead-frames
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
42
Plated through-holes
Applicants:
NIPPON MEKTRON, LTD. [JP/JP]; 12-15, Shibadaimon 1-chome Minato-ku Tokyo 105, JP (AllExceptUS)
OOMACHI, Chikafumi [JP/JP]; JP (UsOnly)
TANAKA, Yasuyuki [JP/JP]; JP (UsOnly)
Inventors:
OOMACHI, Chikafumi; JP
TANAKA, Yasuyuki; JP
Agent:
KAMATA, Shuukou; 112-1, Takuu-cho Ushiku-shi Ibaraki 300-12, JP
Priority Data:
1/28843406.11.1989JP
Title (EN) FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC AND METHOD OF PRODUCING THE SAME
(FR) PLAQUETTE A CIRCUITS FLEXIBLE POUR LE MONTAGE DE CIRCUITS INTEGRES ET PROCEDE DE PRODUCTION DE CETTE PLAQUETTE
Abstract:
(EN) A flexible circuit board for mounting IC has conductor bumps on the rear surface, and they penetrate the flexible circuit board to connect a circuit wiring pattern. The surfaces of the bumps can be coated with a bonding metal depending on the structure of the bumps. Bare IC chips are easily connected to the bumps of the circuit board by a thermal or ultrasonic bonding method. When such bumps or protrusions for bonding to IC pads are provided on the flexible circuit board, tiny holes are preferably formed in the insulating substrate by excimer laser means. The bumps are formed by plating means such as soldering or by a suitable treatment for filling the holes with an electrically conductive material. Further, the bumps should desirably be formed in a semi-spherical shape by the reflow treatment.
(FR) Plaquette à circuits flexible pour le montage de circuits intégrés, présentant des bosses sur sa surface postérieure qui pénètrent dans la plaquette pour relier une configuration de câblage de circuits. Les surfaces des bosses peuvent être recouvertes d'une couche métallique de soudure en fonction de la structure desdites bosses. On peut connecter aisément des puces à circuits intégrés nues aux bosses sur la plaquette à circuits par un procédé de soudage thermique ou à ultrasons. Lors de la création de ces bosses ou saillies, destinées à être soudées à des plots de circuits intégrés, sur la plaquette à circuits flexible, on forme de minuscules trous dans le substrat isolant à l'aide d'un laser excimeur. On crée lesdites bosses à l'aide d'une matière de placage, telle que de la soudure, ou par un traitement approprié pour remplir les trous avec une matière électroconductrice. Il est en outre souhaitable de donner aux bosses une forme semi-cylindrique par un traitement de fusion.
Designated States: US
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP0452506