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1. (WO1991006686) METHOD OF CONTINUOUSLY PLATING METAL PLATES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/006686 International Application No.: PCT/JP1989/001094
Publication Date: 16.05.1991 International Filing Date: 25.10.1989
IPC:
C23C 6/00 (2006.01) ,C23C 26/02 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
6
Coating by casting molten material on the substrate
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
26
Coating not provided for in groups C23C2/-C23C24/87
02
applying molten material to the substrate
Applicants:
NKK CORPORATION [JP/JP]; 1-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100, JP (AllExceptUS)
ISHII, Toshio [JP/JP]; JP (UsOnly)
OKUBO, Yutaka [JP/JP]; JP (UsOnly)
SUGIYAMA, Syunichi [JP/JP]; JP (UsOnly)
ANDO, Yoshitsugu [JP/JP]; JP (UsOnly)
TAJIRI, Yasuhisa [JP/JP]; JP (UsOnly)
KUSAKA, Takeo [JP/JP]; JP (UsOnly)
SAKURAI, Mithitaka [JP/JP]; JP (UsOnly)
Inventors:
ISHII, Toshio; JP
OKUBO, Yutaka; JP
SUGIYAMA, Syunichi; JP
ANDO, Yoshitsugu; JP
TAJIRI, Yasuhisa; JP
KUSAKA, Takeo; JP
SAKURAI, Mithitaka; JP
Agent:
TOMABECHI, Masatoshi; Tsuchiya Bldg., 5th Fl. 14-5, Kyobashi 1-chome Chuo-ku Tokyo 104, JP
Priority Data:
Title (EN) METHOD OF CONTINUOUSLY PLATING METAL PLATES
(FR) PROCEDE DE PLACAGE EN CONTINU DE PLAQUES METALLIQUES
Abstract:
(EN) This invention relates to a plating method consisting of the steps of placing a solid phase plating metal on an object surface of a metal plate being fed, melting the plating metal with the heat of the metal plate, and depositing the molten plating metal in the form of a film on the object metal plate surface. According to this plating method, a molten metal bath is not required at all, and a plating film using a molten metal can be obtained without troubling an operator about various problems arising from a plating operation using a molten metal bath.
(FR) Procédé de placage consistant à placer un métal de placage en phase solide sur la surface à traiter d'une plaque métallique que l'on fait avancer, à fondre le métal de placage sous l'effet de la chaleur de la plaque métallique, et à déposer le métal de placage fondu sous forme d'une pellicule à la surface de la plaque métallique. Ce procédé de placage rend superflue l'utilisation d'un bain de métal en fusion, et on peut obtenir une pellicule de placage en utilisant un métal en fusion, sans que l'opérateur ait à résoudre les différents problèmes que pose le placage à l'aide d'un bain de métal en fusion.
Designated States: KR, US
European Patent Office (DE, FR, GB)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP0450070KR1019920702872